3DIC 2010:
Munich, Germany
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conf/3dic/Fernandez-BolanosI10 export record as
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Jeff Burns :
3D integration - A server perspective.
1-20
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Kenzo Inagaki :
3D R&D technology for the future voyage in Japan.
1-42
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Christophe Zinck :
Keynote speakers day 1: 3D integration with TSV interconnects: Technology trends & market analysis.
1-2
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Vance Tyree :
3DIC multi-project-wafer program: A collaboration to provide fabrication access.
1-17
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G. Deptuch :
3DIC multi-project fabrication run being organized by CMC/CMP/MOSIS and Tezzaron.
1-10
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Valerio Re :
3D ICs and pixel sensors: The Italian VIPIX project and the European AIDA WP3 project.
1-6
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conf/3dic/MarinissenCVK10 export record as
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conf/3dic/ThorolfssonLCF10 export record as
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conf/3dic/MurugesanOBLFTK10 export record as
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Jason D. Reed ,
Scott Goodwin ,
Christopher Gregory ,
Dorota Temple :
Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration.
1-8
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conf/3dic/FukushimaIBMLTK10 export record as
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conf/3dic/AndricekBKMMMNRWWW10 Ladislav Andricek ,
Michael Beimforde ,
Armin Klumpp ,
Anna Macchiolo ,
Karl-Reinhard Merkel ,
Hans-Günther Moser ,
Richard Nisius ,
Rainer Helmut Richter ,
Josef Weber ,
Philipp Weigell ,
Robert Wieland :
Application of the SLID-ICV interconnection technology for the ATLAS pixel upgrade at SLHC.
1-4
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conf/3dic/GolshaniDIBRM10 export record as
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conf/3dic/FarhaneALTBFS10 export record as
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conf/3dic/ZhangWFCLSXSDXCL10 Tao Zhang ,
Kui Wang ,
Yi Feng ,
Yan Chen ,
Qun Li ,
Bing Shao ,
Jing Xie ,
Xiaodi Song ,
Lian Duan ,
Yuan Xie ,
Xu Cheng ,
Youn-Long Lin :
A 3D SoC design for H.264 application with on-chip DRAM stacking.
1-6
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conf/3dic/KiyoyamaLFNKTK10 export record as
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conf/3dic/DeptuchDHLSYZ10 export record as
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conf/3dic/RiouGLTRSWKHKDS10 Gregory Riou ,
Gweltaz Gaudin ,
Didier Landru ,
Catherine Tempesta ,
Ionut Radu ,
Mariam Sadaka ,
Kevin Winstel ,
Emily Kinser ,
Robert Hannon ,
Boris V. Kamenev ,
Michael Darwin ,
Robert Sachs :
Pre bonding metrology solutions for 3D integration.
1-5
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conf/3dic/DaneshtalabELPT10 export record as
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conf/3dic/RaduLGRTLCGSEDCS10 Ionut Radu ,
Didier Landru ,
Gweltaz Gaudin ,
Gregory Riou ,
Catherine Tempesta ,
F. Letertre ,
Léa Di Cioccio ,
Pierric Gueguen ,
Thomas Signamarcheix ,
C. Euvrard ,
Jérôme Dechamp ,
Laurent Clavelier ,
Mariam Sadaka :
Recent Developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking.
1-6
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conf/3dic/MiyamotoMKMONO10 export record as
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conf/3dic/ScandiuzzoCCSPFCG10 export record as
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conf/3dic/HoribeSSKMKOMY10 export record as
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conf/3dic/JourdainBPPWSBBTS10 export record as
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conf/3dic/MiyazakiSUAKMY10 export record as
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conf/3dic/GaudinRLTRSWKH10 Gweltaz Gaudin ,
Gregory Riou ,
Didier Landru ,
Catherine Tempesta ,
Ionut Radu ,
Mariam Sadaka ,
Kevin Winstel ,
Emily Kinser ,
Robert Hannon :
Low temperature direct wafer to wafer bonding for 3D integration: Direct bonding, surface preparation, wafer-to-wafer alignment.
1-4
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conf/3dic/SchneiderHFLRSW10 export record as
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conf/3dic/OosterhuisVECECZ10
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