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"High performance 3D interconnects based on electrochemical etch and liquid ..."
Harry Hedler et al. (2010)
- Harry Hedler, Thomas Scheiter, Markus Schieber, Armin Klumpp, Peter Ramm:
High performance 3D interconnects based on electrochemical etch and liquid metal fill. 3DIC 2010: 1-7
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