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Koichi Takemura
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2020 – today
- 2021
- [c8]Takanori Shimizu, Shigeru Nakamura, Hiroshi Yamaguchi, Koichi Takemura, Kenji Mizutani, Tatsuya Usuki, Yutaka Urino:
Error-Free Operation for Fully Connected Wavelength-Routing Interconnect among 8 FPGAs with 2.8-Tbit/s Total Bandwidth. ECOC 2021: 1-4 - [c7]Takeru Amano, Akihiro Noriki, Isao Tamai, Yasuhiro Ibusuki, Akio Ukita, Satoshi Suda, Takayuki Kurosu, Koichi Takemura, Tsuyoshi Aoki, Daisuke Shimura, Yosuke Onawa, Hiroki Yaegashi:
Polymer Waveguide-coupled Co-packaged Silicon Photonics-die Embedded Package Substrate. OFC 2021: 1-3 - 2020
- [c6]Akihiro Noriki, Isao Tamai, Yasuhiro Ibusuki, Akio Ukita, Satoshi Suda, Koichi Takemura, Daisuke Shimura, Yosuke Onawa, Hiroki Yaegashi, Takeru Amano:
Demonstration of Optical Re-Distribution on Silicon Photonics Die Using Polymer Waveguide and Micro Mirrors. ECOC 2020: 1-4
2010 – 2019
- 2019
- [j1]Takahiro Nakamura, Kenichiro Yashiki, Kenji Mizutani, Takaaki Nedachi, Junichi Fujikata, Masatoshi Tokushima, Jun Ushida, Masataka Noguchi, Daisuke Okamoto, Yasuyuki Suzuki, Takanori Shimizu, Koichi Takemura, Akio Ukita, Yasuhiro Ibusuki, Mitsuru Kurihara, Keizo Kinoshita, Tsuyoshi Horikawa, Hiroshi Yamaguchi, Junichi Tsuchida, Yasuhiko Hagihara, Kazuhiko Kurata:
Fingertip-Size Optical Module, "Optical I/O Core", and Its Application in FPGA. IEICE Trans. Electron. 102-C(4): 333-339 (2019) - [c5]Koichi Takemura, Akio Ukita, Yasuhiro Ibusuki, Mitsuru Kurihara, Akihiro Noriki, Takeru Amano, Daisuke Okamoto, Yasuyuki Suzuki, Kazuhiko Kurata:
Vertical Optical and Electrical Interconnection for Chip-Scale-Packaged Si Photonic Transceivers. 3DIC 2019: 1-6 - 2015
- [c4]Kenichiro Yashiki, Yasuyuki Suzuki, Yasuhiko Hagihara, Mitsuru Kurihara, Masatoshi Tokushima, Junichi Fujikata, Akio Ukita, Koichi Takemura, Takanori Shimizu, Daisuke Okamoto, Jun Ushida, Shigeki Takahashi, Toshinori Uemura, Makoto Okano, Junichi Tsuchida, Takaaki Nedachi, Makoto Fushimi, Ichiro Ogura, Jun Inasaka, Kazuhiko Kurata:
5 mW/Gbps hybrid-integrated Si-photonics-based optical I/O cores and their 25-Gbps/ch error-free operation with over 300-m MMF. OFC 2015: 1-3 - 2010
- [c3]Koichi Ishida, Koichi Takemura, Kazuhiro Baba, Makoto Takamiya, Takayasu Sakurai:
3D stacked buck converter with 15μm thick spiral inductor on silicon interposer for fine-grain power-supply voltage control in SiP's. 3DIC 2010: 1-4
2000 – 2009
- 2009
- [c2]Katsuya Kikuchi, Koichi Takemura, Chihiro Ueda, Osamu Shimada, Toshio Gomyo, Yukiharu Takeuchi, Toshikazu Okubo, Kazuhiro Baba, Masahiro Aoyagi, Toshio Sudo, Kanji Otsuka:
Ultralow impedance evaluation system of wideband frequency for power distribution network of decoupling capacitor embedded substrates. 3DIC 2009: 1-4 - [c1]Koichi Takemura, Katsuya Kikuchi, Chihiro Ueda, Kazuhiro Baba, Masahiro Aoyagi, Kanji Otsuka:
SrTiO3 thin film decoupling capacitors on Si interposers for 3D system integration. 3DIC 2009: 1-5
Coauthor Index
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