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ORCIDAlain Phommahaxay
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2010 – 2019
- 2019
[c7]Fumihiro Inoue
, Julien Bertheau, Samuel Suhard, Alain Phommahaxay, Takuya Ohashi, Tetsuro Kinoshita, Yohei Kinoshita, Eric Beyne:
Protective Layer for Collective Die to Wafer Hybrid Bonding. 3DIC 2019: 1-4- [c6]Dimitrios Velenis, Joeri De Vos, Soon-Wook Kim, Jaber Derakhshandeh, Pieter Bex, Giovanni Capuz, Samuel Suhard, Kenneth June Rebibis, Stefaan Van Huylenbroeck, Erik Jan Marinissen, Alain Phommahaxay, Andy Miller, Gerald Beyer, Geert Van der Plas, Eric Beyne:
Process Complexity and Cost Considerations of Multi-Layer Die Stacks. 3DIC 2019: 1-6 - 2016
- [c5]Joeri De Vos, Lan Peng, Alain Phommahaxay, Joost Van Ongeval, Andy Miller, Eric Beyne, Florian Kurz, Thomas Wagenleiter, Markus Wimplinger, Thomas Uhrmann:
Importance of alignment control during permanent bonding and its impact on via-last alignment for high density 3D interconnects. 3DIC 2016: 1-5 - 2011
- [j1]Geert Van der Plas, Paresh Limaye, Igor Loi, Abdelkarim Mercha, Herman Oprins, Cristina Torregiani, Steven Thijs, Dimitri Linten, Michele Stucchi, Guruprasad Katti, Dimitrios Velenis, Vladimir Cherman, Bart Vandevelde, Veerle Simons, Ingrid De Wolf, Riet Labie, Dan Perry, Stephane Bronckers, Nikolaos Minas, Miro Cupac, Wouter Ruythooren, Jan Van Olmen, Alain Phommahaxay, Muriel de Potter de ten Broeck, Ann Opdebeeck, Michal Rakowski, Bart De Wachter, Morin Dehan, Marc Nelis, Rahul Agarwal, Antonio Pullini, Federico Angiolini, Luca Benini, Wim Dehaene, Youssef Travaly, Eric Beyne, Paul Marchal:
Design Issues and Considerations for Low-Cost 3-D TSV IC Technology. IEEE J. Solid State Circuits 46(1): 293-307 (2011) - [c4]Sandip Halder, Ingrid De Wolf, Alain Phommahaxay, Andy Miller, Mireille Maenhoudt, Gerald Beyer, Bart Swinnen, Eric Beyne:
In-line metrology and inspection for process control during 3D stacking of IC's. 3DIC 2011: 1-4 - [c3]Alain Phommahaxay, Anne Jourdain, Greet Verbinnen, Tobias Woitke, Peter Bisson, Markus Gabriel, Walter Spiess, Alice Guerrero, Jeremy McCutcheon, Rama Puligadda, Pieter Bex, Axel Van den Eede, Bart Swinnen, Gerald Beyer, Andy Miller, Eric Beyne:
Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding. 3DIC 2011: 1-4 - 2010
- [c2]Anne Jourdain, Thibault Buisson, Alain Phommahaxay, Mark Privett, Dan Wallace, Sumant Sood, Peter Bisson, Eric Beyne, Youssef Travaly, Bart Swinnen:
300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications. 3DIC 2010: 1-4 - [c1]Geert Van der Plas, Paresh Limaye, Abdelkarim Mercha, Herman Oprins, Cristina Torregiani, Steven Thijs, Dimitri Linten, Michele Stucchi, Guruprasad Katti, Dimitrios Velenis, Domae Shinichi, Vladimir Cherman, Bart Vandevelde, Veerle Simons, Ingrid De Wolf, Riet Labie, Dan Perry, Stephane Bronckers, Nikolaos Minas, Miro Cupac, Wouter Ruythooren, Jan Van Olmen, Alain Phommahaxay, Muriel de Potter de ten Broeck, Ann Opdebeeck, Michal Rakowski, Bart De Wachter, Morin Dehan, Marc Nelis, Rahul Agarwal, Wim Dehaene, Youssef Travaly, Pol Marchal, Eric Beyne:
Design issues and considerations for low-cost 3D TSV IC technology. ISSCC 2010: 148-149
2000 – 2009
- 2007
- [i1]Alain Phommahaxay, Gaëlle Lissorgues, Lionel Rousseau, Tarik Bourouina, Pierre Nicole:
Surface Conditioning Effect on Vacuum Microelectronics Components Fabricated by Deep Reactive Ion Etching. CoRR abs/0711.3276 (2007)
Coauthor Index
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