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"300mm wafer thinning and backside passivation compatibility with temporary ..."
Anne Jourdain et al. (2010)
- Anne Jourdain, Thibault Buisson, Alain Phommahaxay, Mark Privett, Dan Wallace, Sumant Sood, Peter Bisson, Eric Beyne
, Youssef Travaly, Bart Swinnen:
300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications. 3DIC 2010: 1-4
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