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"Design and early evaluation of a 3-D die stacked chip multi-vector processor."

Ryusuke Egawa et al. (2010)

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DOI: 10.1109/3DIC.2010.5751448

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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  dblp key:
  - conf/3dic/EgawaFNMTK10
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  - https://dblp.org/rec/conf/3dic/EgawaFNMTK10
Ryusuke Egawa, Yusuke Funaya, Ryu-ichi Nagaoka, Akihiro Musa, Hiroyuki Takizawa, Hiroaki Kobayashi:
Design and early evaluation of a 3-D die stacked chip multi-vector processor. 3DIC 2010: 1-8

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