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"Low temperature direct wafer to wafer bonding for 3D integration: Direct ..."
Gweltaz Gaudin et al. (2010)
- Gweltaz Gaudin, Gregory Riou, Didier Landru, Catherine Tempesta, Ionut Radu
, Mariam Sadaka, Kevin Winstel, Emily Kinser, Robert Hannon:
Low temperature direct wafer to wafer bonding for 3D integration: Direct bonding, surface preparation, wafer-to-wafer alignment. 3DIC 2010: 1-4
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