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2010 – 2019
- 2014
[j3]Ryoichi Ishihara, Jin Zhang, Miki Trifunovic, Jaber Derakhshandeh, Negin Golshani, Daniel M. R. Tajari Mofrad, Tao Chen, Kees Beenakker, Tatsuya Shimoda:
Single-Grain Si Thin-Film Transistors for Monolithic 3D-ICs and Flexible Electronics. IEICE Trans. Electron. 97-C(4): 227-237 (2014)- 2012
- [j2]Mottaqiallah Taouil, Said Hamdioui, Kees Beenakker, Erik Jan Marinissen
:
Test Impact on the Overall Die-to-Wafer 3D Stacked IC Cost. J. Electron. Test. 28(1): 15-25 (2012) - 2011
- [c4]Sten Vollebregt, Ryoichi Ishihara, Johan van der Cingel, Kees Beenakker:
Low-temperature bottom-up integration of carbon nanotubes for vertical interconnects in monolithic 3D integrated circuits. 3DIC 2011: 1-4 - 2010
- [c3]Negin Golshani, Jaber Derakhshandeh, Ryoichi Ishihara, C. I. M. Beenakker, Michael Robertson, Thomas Morrison:
Monolithic 3D integration of SRAM and image sensor using two layers of single grain silicon. 3DIC 2010: 1-4 - [c2]Mottaqiallah Taouil, Said Hamdioui, Kees Beenakker, Erik Jan Marinissen:
Test Cost Analysis for 3D Die-to-Wafer Stacking. Asian Test Symposium 2010: 435-441
2000 – 2009
- 2007
- [c1]Nitz Saputra, Mina Danesh, Alessandro Baiano, Ryoichi Ishihara, John R. Long, Wim Metselaar, C. I. M. Beenakker, Nobuo Karaki, Y. Hiroshima, Satoshi Inoue:
Single-grain Si thin-film transistors for analog and RF circuit applications. ESSCIRC 2007: 107-110 - 2006
- [j1]Ryoichi Ishihara, Arie Glazer, Yoel Raab, Peter Rusian, Mannie Dorfan, Benzi Lavi, Ilya Leizerson, Albert Kishinevsky, Yvonne Van Andel, Xin Cao, Wim Metselaar, Kees Beenakker, Sara Stolyarova, Yael Nemirovsky:
A Novel Selected Area Laser Assisted (SALA) System for Crystallization and Doping Processes in Low-Temperature Poly-Si Thin-Film Transistors. IEICE Trans. Electron. 89-C(10): 1377-1382 (2006)
Coauthor Index
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