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ORCIDIEEE International Conference on 3D System Integration (3DIC)
3DIC 2024: Sendai, Japan
- International 3D Systems Integration Conference, 3DIC 2024, Sendai, Japan, September 25-27, 2024. IEEE 2024, ISBN 979-8-3315-1650-5 [contents]
3DIC 2023: Cork, Ireland
- IEEE International 3D Systems Integration Conference, 3DIC 2023, Cork, Ireland, May 10-12, 2023. IEEE 2023, ISBN 979-8-3503-1137-2 [contents]
3DIC 2021: Raleigh, NC, USA
- IEEE International 3D Systems Integration Conference, 3DIC 2021, Raleigh, NC, USA, October 26-29, 2021. IEEE 2021, ISBN 978-1-6654-1706-8 [contents]
3DIC 2019: Sendai, Japan
- 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019. IEEE 2019, ISBN 978-1-7281-4870-0 [contents]
3DIC 2016: San Francisco, CA, USA
- 2016 IEEE International 3D Systems Integration Conference, 3DIC 2016, San Francisco, CA, USA, November 8-11, 2016. IEEE 2016, ISBN 978-1-5090-1399-9 [contents]
3DIC 2015: Sendai, Japan
- 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015. IEEE 2015, ISBN 978-1-4673-9385-0 [contents]
3DIC 2014: Kinsdale, Ireland
- 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014. IEEE 2014, ISBN 978-1-4799-8472-5 [contents]
3DIC 2013: San Francisco, California, USA
- 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. IEEE 2013, ISBN 978-1-4673-6484-3 [contents]
3DIC 2011: Osaka, Japan
- Mitsumasa Koyanagi, Morihiro Kada:
2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. IEEE 2012, ISBN 978-1-4673-2189-1 [contents]
3DIC 2010: Munich, Germany
- IEEE International Conference on 3D System Integration, 3DIC 2010, Munich, Germany, 16-18 November 2010. IEEE 2010, ISBN 978-1-4577-0526-7 [contents]
3DIC 2009: San Francisco, California, USA
- IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009. IEEE 2009, ISBN 978-1-4244-4511-0 [contents]
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