"Post-bond sub-500 nm alignment in 300 mm integrated face-to-face ..."

Weng Hong Teh et al. (2010)

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DOI: 10.1109/3DIC.2010.5751447

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type: Conference or Workshop Paper

metadata version: 2017-05-21

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Weng Hong Teh, C. Deeb, J. Burggraf, D. Arazi, R. Young, C. Senowitz, A. Buxbaum:
Post-bond sub-500 nm alignment in 300 mm integrated face-to-face wafer-to-wafer Cu-Cu thermocompression, Si-Si fusion and oxideoxide fusion bonding. 3DIC 2010: 1-6

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