Остановите войну!
for scientists:
default search action
Search dblp
Full-text search
- > Home
Please enter a search query
- case-insensitive prefix search: default
e.g., sig matches "SIGIR" as well as "signal" - exact word search: append dollar sign ($) to word
e.g., graph$ matches "graph", but not "graphics" - boolean and: separate words by space
e.g., codd model - boolean or: connect words by pipe symbol (|)
e.g., graph|network
Update May 7, 2017: Please note that we had to disable the phrase search operator (.) and the boolean not operator (-) due to technical problems. For the time being, phrase search queries will yield regular prefix search result, and search terms preceded by a minus will be interpreted as regular (positive) search terms.
Author search results
no matches
Venue search results
no matches
Refine list
refine by author
- no options
- temporarily not available
refine by venue
- no options
- temporarily not available
refine by type
- no options
- temporarily not available
refine by access
- no options
- temporarily not available
refine by year
- no options
- temporarily not available
Publication search results
found 109 matches
- 2012
- Mitsumasa Koyanagi, Morihiro Kada:
2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. IEEE 2012, ISBN 978-1-4673-2189-1 [contents] - 2011
- Mayu Aoki, Kazuyuki Hozawa, Kenichi Takeda:
Void reduction in wafer bonding by simultaneously formed ventilation channels. 3DIC 2011: 1-5 - Yuuki Araga, Makoto Nagata, Geert Van der Plas, Jaemin Kim, Nikolaos Minas, Pol Marchal, Youssef Travaly, Michael Libois, Antonio La Manna, Wenqi Zhang, Eric Beyne:
In-tier diagnosis of power domains in 3D TSV ICs. 3DIC 2011: 1-6 - Myat Thu Linn Aung, Eric Teck Heng Lim, Takefumi Yoshikawa, Tony Tae-Hyoung Kim:
Design of capacitive-coupling-based simultaneously bi-directional transceivers for 3DIC. 3DIC 2011: 1-4 - Eric Beyne:
Electrical, thermal and mechanical impact of 3D TSV and 3D stacking technology on advanced CMOS devices - Technology directions. 3DIC 2011: 1-6 - Keith Buchanan, Dave Thomas, Hefin Griffiths, Kathrine Crook, Daniel Archard, Mark Carruthers, Masahiko Tanaka:
Plasma etch and dielectric deposition processes for TSV Reveal. 3DIC 2011: 1-2 - Fa Xing Che, Wahyuaji Narottama Putra, A. Heryanto, A. Trigg, S. Gao, Chee Lip Gan:
Numerical and experimental study on Cu protrusion of Cu-filled through-silicon vias (TSV). 3DIC 2011: 1-6 - Kuan-Neng Chen, Z. Xu, Fei Liu, Cheng-Ta Ko, Chuan-An Cheng, W. C. Huang, H. L. Lin, C. Cabral, Zhi-Cheng Hsiao, N. Klymko, Hsin-Chia Fu, Y. H. Chen, Jian-Qiang Lu, Wei-Chung Lo:
Cu-based bonding technology for 3D integration applications. 3DIC 2011: 1-4 - Sung-Hoon Choa, Haeng-Soo Lee, Kyoung-Ho Kim:
Numerical analysis of bonding process-induced deformation for 3D package. 3DIC 2011: 1-5 - Léa Di Cioccio, Rachid Taibi, Cédrick Chappaz, Stéphane Moreau, Laurent-Luc Chapelon, Thomas Signamarcheix:
200°C direct bonding copper interconnects : Electrical results and reliability. 3DIC 2011: 1-4 - Joseph Romen Cubillo, Roshan Weerasekera, Zaw Zaw Oo, En-Xiao Liu, Bob Conn, Surya Bhattacharya, Robert Patti:
Interconnect design and analysis for Through Silicon Interposers (TSIs). 3DIC 2011: 1-6 - Masoud Daneshtalab, Masoumeh Ebrahimi, Pasi Liljeberg, Juha Plosila, Hannu Tenhunen:
Memory-efficient logic layer communication platform for 3D-stacked memory-on-processor architectures. 3DIC 2011: 1-8 - Masoud Daneshtalab, Masoumeh Ebrahimi, Juha Plosila:
HIBS - Novel inter-layer bus structure for stacked architectures. 3DIC 2011: 1-7 - G. Druais, Pascal Ancey, C. Aumont, V. Caubet, Laurent-Luc Chapelon, C. Chaton, Séverine Cheramy, S. Cordova, E. Cirot, Jean-Philippe Colonna, Perceval Coudrain, T. Divel, Y. Dodo, Alexis Farcy, N. Guitard, K. Haxaire, Nicolas Hotellier, F. Leverd, R. Liou, Jean Michailos, A. Ostrovsky, Sebastien Petitdidier, J. Pruvost, D. Riquet, O. Robin, E. Saugier, Nicolas Sillon:
3D integration demonstration of a wireless product with design partitioning. 3DIC 2011: 1-5 - Ryusuke Egawa, Yusuke Funaya, Ryu-ichi Nagaoka, Yusuke Endo, Akihiro Musa, Hiroyuki Takizawa, Hiroaki Kobayashi:
Effects of 3-D stacked vector cache on energy consumption. 3DIC 2011: 1-6 - A. Ege Engin, N. Srinidhi Raghavan:
Metal semiconductor (MES) TSVs in 3D ICs: Electrical modeling and design. 3DIC 2011: 1-4 - P. Enquist:
Scalable direct bond technology and applications driving adoption. 3DIC 2011: 1-5 - Paul D. Franzon, W. Rhett Davis, Zheng Zhou, Shivam Priyadarshi, Matthew Hogan, Tanay Karnik, Ganapti Srinavas:
Coordinating 3D designs: Interface IP, standards or free form? 3DIC 2011: 1-3 - Takafumi Fukushima, Yuki Ohara, Jichoel Bea, Mariappan Murugesan, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi:
Temporary bonding strength control for self-assembly-based 3D integration. 3DIC 2011: 1-4 - Futoshi Furuta, Kenichi Osada:
6 Tbps/W, 1 Tbps/mm2, 3D interconnect using adaptive timing control and low capacitance TSV. 3DIC 2011: 1-4 - Sandip Halder, Ingrid De Wolf, Alain Phommahaxay, Andy Miller, Mireille Maenhoudt, Gerald Beyer, Bart Swinnen, Eric Beyne:
In-line metrology and inspection for process control during 3D stacking of IC's. 3DIC 2011: 1-4 - Omar Hammami, A. M'zah, Khawla Hamwi:
Design of 3D-IC for butterfly NOC based 64 PE-multicore: Analysis and design space exploration. 3DIC 2011: 1-4 - Takaaki Hanada, Hiroshi Sasaki, Koji Inoue, Kazuaki J. Murakami:
Performance evaluation of 3D stacked multi-core processors with temperature consideration. 3DIC 2011: 1-5 - Teruyoshi Hatanaka, Koh Johguchi, Ken Takeuchi:
A 3D-Integration method to compensate output voltage degradation of boost converter for compact Solid-State-Drives. 3DIC 2011: 1-4 - Masanori Hayase, Naoki Mizukoshi, Masayuki Nagao:
Copper deep via superfilling by selective accelerator deactivation. 3DIC 2011: 1-4 - Taro Hayashi, Kazuo Kondo, Minoru Takeuchi, Yushi Suzuki, Takeyasu Saito, Naoki Okamoto, Masao Marunaka, Takayuki Tsuchiya, Masaru Bunya:
3D interconnected technology by high speed copper electrodeposition using diallylamine levelers. 3DIC 2011: 1-4 - Andy Heinig, Christoph Sohrmann:
Multi-step approach for thermal optimization of 3D-IC and package. 3DIC 2011: 1-5 - Kazuyuki Hozawa, Futoshi Furuta, Yuko Hanaoka, Mayu Aoki, Kenichi Takeda, Katsuyuki Sakuma, Kang Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi:
Chip-level TSV integration for rapid prototyping of 3D system LSIs. 3DIC 2011: 1-4 - Y. H. Hu, C. S. Liu, M. J. Lii, Kenneth J. Rebibis, Anne Jourdain, Antonio La Manna, Gerald Beyer, Eric Beyne, C. H. Yu:
3D stacking using Cu-Cu direct bonding. 3DIC 2011: 1-4 - Toru Ikeda, Masatoshi Oka, Shinya Kawahara, Noriyuki Miyazaki, Keiji Matsumoto, Sayuri Kohara, Yasumitsu Orii, Fumiaki Yamada, Morihiro Kada:
Combination between the nonlinear finite element analyses and the strain measurement using the digital image correlation for a new 3D SIC package. 3DIC 2011: 1-6
skipping 79 more matches
loading more results
failed to load more results, please try again later
manage site settings
To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.
Unpaywalled article links
Add open access links from to the list of external document links (if available).
Privacy notice: By enabling the option above, your browser will contact the API of unpaywall.org to load hyperlinks to open access articles. Although we do not have any reason to believe that your call will be tracked, we do not have any control over how the remote server uses your data. So please proceed with care and consider checking the Unpaywall privacy policy.
Archived links via Wayback Machine
For web page which are no longer available, try to retrieve content from the of the Internet Archive (if available).
Privacy notice: By enabling the option above, your browser will contact the API of archive.org to check for archived content of web pages that are no longer available. Although we do not have any reason to believe that your call will be tracked, we do not have any control over how the remote server uses your data. So please proceed with care and consider checking the Internet Archive privacy policy.
Reference lists
Add a list of references from , , and to record detail pages.
load references from crossref.org and opencitations.net
Privacy notice: By enabling the option above, your browser will contact the APIs of crossref.org, opencitations.net, and semanticscholar.org to load article reference information. Although we do not have any reason to believe that your call will be tracked, we do not have any control over how the remote server uses your data. So please proceed with care and consider checking the Crossref privacy policy and the OpenCitations privacy policy, as well as the AI2 Privacy Policy covering Semantic Scholar.
Citation data
Add a list of citing articles from and to record detail pages.
load citations from opencitations.net
Privacy notice: By enabling the option above, your browser will contact the API of opencitations.net and semanticscholar.org to load citation information. Although we do not have any reason to believe that your call will be tracked, we do not have any control over how the remote server uses your data. So please proceed with care and consider checking the OpenCitations privacy policy as well as the AI2 Privacy Policy covering Semantic Scholar.
OpenAlex data
Load additional information about publications from .
Privacy notice: By enabling the option above, your browser will contact the API of openalex.org to load additional information. Although we do not have any reason to believe that your call will be tracked, we do not have any control over how the remote server uses your data. So please proceed with care and consider checking the information given by OpenAlex.
retrieved on 2024-05-27 05:12 CEST from data curated by the dblp team
all metadata released as open data under CC0 1.0 license
see also: Terms of Use | Privacy Policy | Imprint