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"3D interconnected technology by high speed copper electrodeposition using ..."
Taro Hayashi et al. (2011)
- Taro Hayashi, Kazuo Kondo, Minoru Takeuchi, Yushi Suzuki, Takeyasu Saito, Naoki Okamoto, Masao Marunaka, Takayuki Tsuchiya, Masaru Bunya:
3D interconnected technology by high speed copper electrodeposition using diallylamine levelers. 3DIC 2011: 1-4
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