"3D interconnected technology by high speed copper electrodeposition using ..."

Taro Hayashi et al. (2011)

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DOI: 10.1109/3DIC.2012.6262983

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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  - conf/3dic/HayashiKTSSOMTB11
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  - https://dblp.org/rec/conf/3dic/HayashiKTSSOMTB11
Taro Hayashi, Kazuo Kondo, Minoru Takeuchi, Yushi Suzuki, Takeyasu Saito, Naoki Okamoto, Masao Marunaka, Takayuki Tsuchiya, Masaru Bunya:
3D interconnected technology by high speed copper electrodeposition using diallylamine levelers. 3DIC 2011: 1-4

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