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"Cu-based bonding technology for 3D integration applications."

Kuan-Neng Chen et al. (2011)

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DOI: 10.1109/3DIC.2012.6262974

access: closed

type: Conference or Workshop Paper

metadata version: 2024-04-20

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Kuan-Neng Chen, Z. Xu, Fei Liu, Cheng-Ta Ko, Chuan-An Cheng, W. C. Huang, H. L. Lin, C. Cabral, Zhi-Cheng Hsiao, N. Klymko, Hsin-Chia Fu, Y. H. Chen, Jian-Qiang Lu, Wei-Chung Lo:
Cu-based bonding technology for 3D integration applications. 3DIC 2011: 1-4

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