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"Numerical analysis of bonding process-induced deformation for 3D package."

Sung-Hoon Choa, Haeng-Soo Lee, Kyoung-Ho Kim (2011)

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DOI: 10.1109/3DIC.2012.6263000

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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  dblp key:
  - conf/3dic/ChoaLK11
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Sung-Hoon Choa, Haeng-Soo Lee, Kyoung-Ho Kim:
Numerical analysis of bonding process-induced deformation for 3D package. 3DIC 2011: 1-5

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