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Gerald Beyer
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2020 – today
- 2023
- [c14]Eric Beyne, Anne Jourdain, Gerald Beyer:
Nano-Through Silicon Vias (nTSV) for Backside Power Delivery Networks (BSPDN). VLSI Technology and Circuits 2023: 1-2 - 2022
- [c13]Anabela Veloso, Anne Jourdain, D. Radisic, Rongmei Chen, G. Arutchelvan, B. O'Sullivan, Hiroaki Arimura, Michele Stucchi, An De Keersgieter, M. Hosseini, T. Hopf, K. D'Have, S. Wang, E. Dupuy, G. Mannaert, Kevin Vandersmissen, S. Iacovo, P. Marien, S. Choudhury, F. Schleicher
, F. Sebaai, Yusuke Oniki, X. Zhou, A. Gupta, Tom Schram, B. Briggs, C. Lorant, E. Rosseel, Andriy Hikavyy, Roger Loo
, J. Geypen, D. Batuk, G. T. Martinez, J. P. Soulie, Katia Devriendt, B. T. Chan, S. Demuynck, Gaspard Hiblot, Geert Van der Plas, Julien Ryckaert, Gerald Beyer, E. Dentoni Litta, Eric Beyne, Naoto Horiguchi:
Scaled FinFETs Connected by Using Both Wafer Sides for Routing via Buried Power Rails. VLSI Technology and Circuits 2022: 284-285
2010 – 2019
- 2019
- [c12]Dimitrios Velenis, Joeri De Vos, Soon-Wook Kim, Jaber Derakhshandeh, Pieter Bex, Giovanni Capuz, Samuel Suhard, Kenneth June Rebibis, Stefaan Van Huylenbroeck, Erik Jan Marinissen, Alain Phommahaxay, Andy Miller, Gerald Beyer, Geert Van der Plas, Eric Beyne
:
Process Complexity and Cost Considerations of Multi-Layer Die Stacks. 3DIC 2019: 1-6 - 2018
- [c11]Yunlong Li, Michele Stucchi, Stefaan Van Huylenbroeck, Geert Van der Plas, Gerald Beyer, Eric Beyne
, Kristof Croes:
TSV process-induced MOS reliability degradation. IRPS 2018: 5 - 2016
- [c10]Jaber Derakhshandeh, Lin Hou, Inge De Preter, Carine Gerets, Samuel Suhard, Vikas Dubey
, Geraldine Jamieson, Fumihiro Inoue
, Tomas Webers, Pieter Bex, Giovanni Capuz, Eric Beyne
, John Slabbekoorn, Teng Wang, Anne Jourdain, Gerald Beyer, Kenneth June Rebibis, Andy Miller:
Die to wafer 3D stacking for below 10um pitch microbumps. 3DIC 2016: 1-4 - [c9]Stefaan Van Huylenbroeck, Yunlong Li, Michele Stucchi, Lieve Bogaerts, Joeri De Vos, Gerald Beyer, Eric Beyne
, Mohand Brouri, Praveen Nalla, Sanjay Gopinath, Matthew Thorum, Joe Richardson, Jengyi Yu:
Continuity and reliability assessment of a scalable 3×50μm and 2×40μm via-middle TSV module. 3DIC 2016: 1-4 - [c8]Anne Jourdain, Joeri De Vos, Fumihiro Inoue
, Kenneth J. Rebibis, Andy Miller, Gerald Beyer, Eric Beyne
, Edward Walsby, Jash Patel, Oliver Ansell, Janet Hopkins, Huma Ashraf, Dave Thomas:
Extreme wafer thinning optimization for via-last applications. 3DIC 2016: 1-5 - [c7]C. Roda Neve, Mikael Detalle, Philip Nolmans, Yunlong Li, Joeri De Vos, Geert Van der Plas, Gerald Beyer, Eric Beyne
:
High-density and low-leakage novel embedded 3D MIM capacitor on Si interposer. 3DIC 2016: 1-4 - 2015
- [c6]Soon-Wook Kim, Lan Peng, Andy Miller, Gerald Beyer, Eric Beyne
, Chung-Sun Lee:
Permanent wafer bonding in the low temperature by using various plasma enhanced chemical vapour deposition dielectrics. 3DIC 2015: TS7.2.1-TS7.2.4 - 2014
- [j1]Yunlong Li, Stefaan Van Huylenbroeck, Els Van Besien, Xiaoping Shi, Chen Wu, Michele Stucchi, Gerald Beyer, Eric Beyne
, Ingrid De Wolf, Kristof Croes:
Reliability challenges for barrier/liner system in high aspect ratio through silicon vias. Microelectron. Reliab. 54(9-10): 1949-1952 (2014) - 2012
- [c5]Wei Guo, Geert Van der Plas, Andrej Ivankovic, Geert Eneman, Vladimir Cherman, Bart De Wachter, Abdelkarim Mercha, Mario Gonzalez, Yann Civale, Augusto Redolfi, Thibault Buisson, A. Jourdan, Bart Vandevelde, Kenneth J. Rebibis, Ingrid De Wolf, Antonio La Manna, Gerald Beyer, Eric Beyne
, Bart Swinnen:
3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps. ICICDT 2012: 1-4 - 2011
- [c4]Sandip Halder
, Ingrid De Wolf, Alain Phommahaxay, Andy Miller, Mireille Maenhoudt, Gerald Beyer, Bart Swinnen, Eric Beyne
:
In-line metrology and inspection for process control during 3D stacking of IC's. 3DIC 2011: 1-4 - [c3]Y. H. Hu, C. S. Liu, M. J. Lii, Kenneth J. Rebibis, Anne Jourdain, Antonio La Manna, Gerald Beyer, Eric Beyne
, C. H. Yu:
3D stacking using Cu-Cu direct bonding. 3DIC 2011: 1-4 - [c2]Andrej Ivankovic, Geert Van der Plas
, V. Moroz, M. Choi, Vladimir Cherman, Abdelkarim Mercha, Paul Marchal, Marcel Gonzalez, Geert Eneman, Wenqi Zhang, Thibault Buisson, Mikael Detalle, Antonio La Manna, Diederik Verkest, Gerald Beyer, Eric Beyne
, Bart Vandevelde, Ingrid De Wolf, Dirk Vandepitte:
Analysis of microbump induced stress effects in 3D stacked IC technologies. 3DIC 2011: 1-5 - [c1]Alain Phommahaxay, Anne Jourdain, Greet Verbinnen, Tobias Woitke, Peter Bisson, Markus Gabriel, Walter Spiess, Alice Guerrero, Jeremy McCutcheon, Rama Puligadda, Pieter Bex, Axel Van den Eede, Bart Swinnen, Gerald Beyer, Andy Miller, Eric Beyne
:
Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding. 3DIC 2011: 1-4
Coauthor Index
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last updated on 2024-08-08 20:18 CEST by the dblp team
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