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"200°C direct bonding copper interconnects : Electrical results and ..."
Léa Di Cioccio et al. (2011)
- Léa Di Cioccio, Rachid Taibi, Cédrick Chappaz, Stéphane Moreau
, Laurent-Luc Chapelon, Thomas Signamarcheix:
200°C direct bonding copper interconnects : Electrical results and reliability. 3DIC 2011: 1-4
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