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Perceval Coudrain
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2020 – today
- 2021
- [j3]Pascal Vivet
, Eric Guthmuller
, Yvain Thonnart
, Gaël Pillonnet
, César Fuguet Tortolero
, Ivan Miro-Panades
, Guillaume Moritz, Jean Durupt, Christian Bernard, Didier Varreau, Julian J. H. Pontes
, Sébastien Thuries, David Coriat, Michel Harrand
, Denis Dutoit, Didier Lattard, Lucile Arnaud, Jean Charbonnier
, Perceval Coudrain
, Arnaud Garnier, Frédéric Berger, Alain Gueugnot, Alain Greiner, Quentin L. Meunier
, Alexis Farcy, Alexandre Arriordaz
, Séverine Cheramy
, Fabien Clermidy:
IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management. IEEE J. Solid State Circuits 56(1): 79-97 (2021) - 2020
- [c10]Pascal Vivet
, Eric Guthmuller
, Yvain Thonnart
, Gaël Pillonnet
, Guillaume Moritz, Ivan Miro-Panades, César Fuguet Tortolero
, Jean Durupt, Christian Bernard, Didier Varreau, Julian J. H. Pontes, Sébastien Thuries, David Coriat, Michel Harrand, Denis Dutoit, Didier Lattard, Lucile Arnaud, Jean Charbonnier, Perceval Coudrain
, Arnaud Garnier, Frédéric Berger, Alain Gueugnot, Alain Greiner, Quentin L. Meunier, Alexis Farcy, Alexandre Arriordaz, Séverine Cheramy, Fabien Clermidy:
2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm2 Inter-Chiplet Interconnects and 156mW/mm2@ 82%-Peak-Efficiency DC-DC Converters. ISSCC 2020: 46-48
2010 – 2019
- 2016
- [j2]Perceval Coudrain
, Papa Momar Souare, Rafael Prieto, Vincent Fiori, Alexis Farcy, Laurent Le Pailleur, Jean-Philippe Colonna, Cristiano Santos, Pascal Vivet
, M. Haykel Ben Jamaa, Denis Dutoit, François de Crecy, Sylvain Dumas, Christian Chancel, Didier Lattard, Séverine Cheramy:
Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits. IEEE Des. Test 33(3): 21-36 (2016) - [c9]Rafael Prieto, Perceval Coudrain
, Jean-Philippe Colonna, Y. Hallez, Christian Chancel, Venceslass Rat, Sylvain Dumas, G. Romano, R. Franiatte, C. Brunet-Manquiat, Séverine Cheramy, Alexis Farcy:
Heat spreading packaging solutions for hybrid bonded 3D-ICs. 3DIC 2016: 1-6 - [c8]Cristiano Santos, Pascal Vivet
, Sébastien Thuries, Olivier Billoint, Jean-Philippe Colonna, Perceval Coudrain
, Lee Wang:
Thermal performance of CoolCube™ monolithic and TSV-based 3D integration processes. 3DIC 2016: 1-5 - 2015
- [c7]Cristiano Santos, Rafael Prieto, Pascal Vivet
, Jean-Philippe Colonna, Perceval Coudrain
, Ricardo Reis
:
Graphite-based heat spreaders for hotspot mitigation in 3D ICs. 3DIC 2015: TS10.4.1-TS10.4.4 - 2014
- [c6]Yann Beilliard
, Stéphane Moreau
, Léa Di Cioccio, Perceval Coudrain
, G. Romano, A. Nowodzinski, F. Aussenac, P.-H. Jouneau, E. Rolland, Thomas Signamarcheix:
Advances toward reliable high density Cu-Cu interconnects by Cu-SiO2 direct hybrid bonding. 3DIC 2014: 1-8 - [c5]Cristiano Santos, Papa Momar Souare, François de Crecy, Perceval Coudrain
, Jean-Philippe Colonna, Pascal Vivet, Andras Borbely, Ricardo Reis
, M. Haykel Ben Jamaa, Vincent Fiori, Alexis Farcy:
Using TSVs for thermal mitigation in 3D circuits: Wish and truth. 3DIC 2014: 1-8 - [c4]Cristiano Santos, Pascal Vivet
, Jean-Philippe Colonna, Perceval Coudrain
, Ricardo Augusto da Luz Reis
:
Thermal performance of 3D ICs: Analysis and alternatives. 3DIC 2014: 1-7 - 2013
- [c3]Yann Beilliard
, Perceval Coudrain
, Léa Di Cioccio, Stéphane Moreau
, Loic Sanchez, Brigitte Montmayeul, Thomas Signamarcheix, Rafael Estevez, Guillaume Parry
:
Chip to wafer copper direct bonding electrical characterization and thermal cycling. 3DIC 2013: 1-7 - [c2]Papa Momar Souare, François de Crecy, Vincent Fiori, M. Haykel Ben Jamaa, Alexis Farcy, Sébastien Gallois-Garreignot, Andras Borbely, Jean-Philippe Colonna, Perceval Coudrain
, B. Giraud, C. Laviron, Séverine Cheramy, Clément Tavernier, Jean Michailos:
Thermal correlation between measurements and FEM simulations in 3D ICs. 3DIC 2013: 1-6 - 2012
- [j1]Perrine Batude, Thomas Ernst
, Julien Arcamone
, Gregory Arndt, Perceval Coudrain
, Pierre-Emmanuel Gaillardon:
3-D Sequential Integration: A Key Enabling Technology for Heterogeneous Co-Integration of New Function With CMOS. IEEE J. Emerg. Sel. Topics Circuits Syst. 2(4): 714-722 (2012) - 2011
- [c1]G. Druais, Pascal Ancey, C. Aumont, V. Caubet, Laurent-Luc Chapelon, C. Chaton, Séverine Cheramy, S. Cordova, E. Cirot, Jean-Philippe Colonna, Perceval Coudrain
, T. Divel, Y. Dodo, Alexis Farcy, N. Guitard, K. Haxaire, Nicolas Hotellier, F. Leverd, R. Liou, Jean Michailos, A. Ostrovsky, Sebastien Petitdidier, J. Pruvost, D. Riquet, O. Robin, E. Saugier, Nicolas Sillon:
3D integration demonstration of a wireless product with design partitioning. 3DIC 2011: 1-5
Coauthor Index
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last updated on 2024-07-09 21:59 CEST by the dblp team
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