default search action
"Void reduction in wafer bonding by simultaneously formed ventilation channels."
Mayu Aoki, Kazuyuki Hozawa, Kenichi Takeda (2011)
- Mayu Aoki, Kazuyuki Hozawa, Kenichi Takeda:
Void reduction in wafer bonding by simultaneously formed ventilation channels. 3DIC 2011: 1-5
manage site settings
To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.