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"Void reduction in wafer bonding by simultaneously formed ventilation channels."

Mayu Aoki, Kazuyuki Hozawa, Kenichi Takeda (2011)

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DOI: 10.1109/3DIC.2012.6262992

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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Mayu Aoki, Kazuyuki Hozawa, Kenichi Takeda:
Void reduction in wafer bonding by simultaneously formed ventilation channels. 3DIC 2011: 1-5

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