2012 share record
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Mitsumasa Koyanagi , Morihiro Kada : 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. IEEE 2012 , ISBN 978-1-4673-2189-1 [contents] 2011 share record
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Mayu Aoki , Kazuyuki Hozawa , Kenichi Takeda : Void reduction in wafer bonding by simultaneously formed ventilation channels. 3DIC 2011 : 1-5 export record
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conf/3dic/AragaNPKMMTLMZB11 share record
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Yuuki Araga , Makoto Nagata , Geert Van der Plas , Jaemin Kim , Nikolaos Minas , Pol Marchal , Youssef Travaly , Michael Libois , Antonio La Manna , Wenqi Zhang , Eric Beyne : In-tier diagnosis of power domains in 3D TSV ICs. 3DIC 2011 : 1-6 share record
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Myat Thu Linn Aung , Eric Teck Heng Lim , Takefumi Yoshikawa , Tony Tae-Hyoung Kim : Design of capacitive-coupling-based simultaneously bi-directional transceivers for 3DIC. 3DIC 2011 : 1-4 share record
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Eric Beyne : Electrical, thermal and mechanical impact of 3D TSV and 3D stacking technology on advanced CMOS devices - Technology directions. 3DIC 2011 : 1-6 export record
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conf/3dic/BuchananTGCACT11 share record
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Keith Buchanan , Dave Thomas , Hefin Griffiths , Kathrine Crook , Daniel Archard , Mark Carruthers , Masahiko Tanaka : Plasma etch and dielectric deposition processes for TSV Reveal. 3DIC 2011 : 1-2 share record
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Fa Xing Che , Wahyuaji Narottama Putra , A. Heryanto , A. Trigg , S. Gao , Chee Lip Gan : Numerical and experimental study on Cu protrusion of Cu-filled through-silicon vias (TSV). 3DIC 2011 : 1-6 export record
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conf/3dic/ChenXLKCHLCHKFCLL11 share record
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Kuan-Neng Chen , Z. Xu , Fei Liu , Cheng-Ta Ko , Chuan-An Cheng , W. C. Huang , H. L. Lin , C. Cabral , Zhi-Cheng Hsiao , N. Klymko , Hsin-Chia Fu , Y. H. Chen , Jian-Qiang Lu , Wei-Chung Lo : Cu-based bonding technology for 3D integration applications. 3DIC 2011 : 1-4 share record
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Sung-Hoon Choa , Haeng-Soo Lee , Kyoung-Ho Kim : Numerical analysis of bonding process-induced deformation for 3D package. 3DIC 2011 : 1-5 share record
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Léa Di Cioccio , Rachid Taibi , Cédrick Chappaz , Stéphane Moreau , Laurent-Luc Chapelon , Thomas Signamarcheix : 200°C direct bonding copper interconnects : Electrical results and reliability. 3DIC 2011 : 1-4 export record
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conf/3dic/CubilloWOLCBP11 share record
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Joseph Romen Cubillo , Roshan Weerasekera , Zaw Zaw Oo , En-Xiao Liu , Bob Conn , Surya Bhattacharya , Robert Patti : Interconnect design and analysis for Through Silicon Interposers (TSIs). 3DIC 2011 : 1-6 export record
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conf/3dic/DaneshtalabELPT11 share record
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Masoud Daneshtalab , Masoumeh Ebrahimi , Pasi Liljeberg , Juha Plosila , Hannu Tenhunen : Memory-efficient logic layer communication platform for 3D-stacked memory-on-processor architectures. 3DIC 2011 : 1-8 export record
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conf/3dic/DaneshtalabEP11 share record
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Masoud Daneshtalab , Masoumeh Ebrahimi , Juha Plosila : HIBS - Novel inter-layer bus structure for stacked architectures. 3DIC 2011 : 1-7 share record
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Ryusuke Egawa , Yusuke Funaya , Ryu-ichi Nagaoka , Yusuke Endo , Akihiro Musa , Hiroyuki Takizawa , Hiroaki Kobayashi : Effects of 3-D stacked vector cache on energy consumption. 3DIC 2011 : 1-6 share record
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A. Ege Engin , N. Srinidhi Raghavan : Metal semiconductor (MES) TSVs in 3D ICs: Electrical modeling and design. 3DIC 2011 : 1-4 share record
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P. Enquist : Scalable direct bond technology and applications driving adoption. 3DIC 2011 : 1-5 export record
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conf/3dic/FranzonDZPHKS11 share record
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Paul D. Franzon , W. Rhett Davis , Zheng Zhou , Shivam Priyadarshi , Matthew Hogan , Tanay Karnik , Ganapti Srinavas : Coordinating 3D designs: Interface IP, standards or free form? 3DIC 2011 : 1-3 export record
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conf/3dic/FukushimaOBMLTK11 share record
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Takafumi Fukushima , Yuki Ohara , Jichoel Bea , Mariappan Murugesan , Kang Wook Lee , Tetsu Tanaka , Mitsumasa Koyanagi : Temporary bonding strength control for self-assembly-based 3D integration. 3DIC 2011 : 1-4 share record
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Futoshi Furuta , Kenichi Osada : 6 Tbps/W, 1 Tbps/mm2 , 3D interconnect using adaptive timing control and low capacitance TSV. 3DIC 2011 : 1-4 export record
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conf/3dic/HalderWPMMBSB11 share record
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Sandip Halder , Ingrid De Wolf , Alain Phommahaxay , Andy Miller , Mireille Maenhoudt , Gerald Beyer , Bart Swinnen , Eric Beyne : In-line metrology and inspection for process control during 3D stacking of IC's. 3DIC 2011 : 1-4 share record
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Omar Hammami , A. M'zah , Khawla Hamwi : Design of 3D-IC for butterfly NOC based 64 PE-multicore: Analysis and design space exploration. 3DIC 2011 : 1-4 share record
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Takaaki Hanada , Hiroshi Sasaki , Koji Inoue , Kazuaki J. Murakami : Performance evaluation of 3D stacked multi-core processors with temperature consideration. 3DIC 2011 : 1-5 share record
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Teruyoshi Hatanaka , Koh Johguchi , Ken Takeuchi : A 3D-Integration method to compensate output voltage degradation of boost converter for compact Solid-State-Drives. 3DIC 2011 : 1-4 share record
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Masanori Hayase , Naoki Mizukoshi , Masayuki Nagao : Copper deep via superfilling by selective accelerator deactivation. 3DIC 2011 : 1-4 export record
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conf/3dic/HayashiKTSSOMTB11 share record
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Taro Hayashi , Kazuo Kondo , Minoru Takeuchi , Yushi Suzuki , Takeyasu Saito , Naoki Okamoto , Masao Marunaka , Takayuki Tsuchiya , Masaru Bunya : 3D interconnected technology by high speed copper electrodeposition using diallylamine levelers. 3DIC 2011 : 1-4 share record
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Andy Heinig , Christoph Sohrmann : Multi-step approach for thermal optimization of 3D-IC and package. 3DIC 2011 : 1-5 export record
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conf/3dic/HozawaFHATSLFK11 share record
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Kazuyuki Hozawa , Futoshi Furuta , Yuko Hanaoka , Mayu Aoki , Kenichi Takeda , Katsuyuki Sakuma , Kang Wook Lee , Takafumi Fukushima , Mitsumasa Koyanagi : Chip-level TSV integration for rapid prototyping of 3D system LSIs. 3DIC 2011 : 1-4 share record
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Y. H. Hu , C. S. Liu , M. J. Lii , Kenneth J. Rebibis , Anne Jourdain , Antonio La Manna , Gerald Beyer , Eric Beyne , C. H. Yu : 3D stacking using Cu-Cu direct bonding. 3DIC 2011 : 1-4 export record
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conf/3dic/IkedaOKMMKOYK11 share record
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Toru Ikeda , Masatoshi Oka , Shinya Kawahara , Noriyuki Miyazaki , Keiji Matsumoto , Sayuri Kohara , Yasumitsu Orii , Fumiaki Yamada , Morihiro Kada : Combination between the nonlinear finite element analyses and the strain measurement using the digital image correlation for a new 3D SIC package. 3DIC 2011 : 1-6