ASP-DAC 2009: Yokohama, Japan

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On-chip communication architectures

Dealing with thermal issues

Advances in behavioral synthesis

University LSI design contest

MPSoC and IP integration

Power analysis and optimization

Logic and arithmetic optimization

EDA acceleration using new architectures

System-level design of 3D chips and configurable systems

Advances in timing analysis and modeling

Hardware dependent software for multi- and many-core embedded systems

System level architectures

Beyond traditional floorplanning and placement

Signal/power integrity and simulation

Challenges in 3D integrated circuit design

Energy-aware system level design methodology

Design for manufacturing and reliability

Analog, RF and mixed-signal CAD

Designers' forum: consumer SoC

System level simulation and modeling

Chip and package routing techniques