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Publication search results
found 47 matches
- 2014
- Ricky Anthony, Santosh Kulkarni, Ningning Wang, Seán Cian O'Mathuna:
Advanced processing for high efficiency inductors for 2.5D/3D Power Supply in Package. 3DIC 2014: 1-4 - Yuuki Araga, Kikuchi Katsuya, Masahiro Aoyagi:
Substrate monitoring system for inspecting defects in TSV-based data buses. 3DIC 2014: 1-5 - Yann Beilliard, Stéphane Moreau, Léa Di Cioccio, Perceval Coudrain, G. Romano, A. Nowodzinski, F. Aussenac, P.-H. Jouneau, E. Rolland, Thomas Signamarcheix:
Advances toward reliable high density Cu-Cu interconnects by Cu-SiO2 direct hybrid bonding. 3DIC 2014: 1-8 - Tomasz Bieniek, Grzegorz Janczyk, Magdalena Ekwinska, T. Budzynski, Piotr Gluszko, Piotr Grabiec, Andrzej Kociubinski:
Novel methodology for 3D MEMS-IC design and co-simulation on MEMS microphone smart system example. 3DIC 2014: 1-5 - Sonda Chtourou, Mohamed Abid, Vinod Pangracious, Emna Amouri, Zied Marrakchi, Habib Mehrez:
Three-dimensional Mesh of Clusters: An alternative unified high performance interconnect architecture for 3D-FPGA implementation. 3DIC 2014: 1-7 - Khadim Dieng, Philippe Artillan, Cédric Bermond, Olivier Guiller, Thierry Lacrevaz, Sylvain Joblot, Gregory Houzet, Alexis Farcy, Yann Lamy, Bernard Fléchet:
Electrical model and characterization of Through Silicon Capacitors (TSC) in silicon interposer. 3DIC 2014: 1-8 - Wei Feng, Naoya Watanabe, Haruo Shimamoto, Katsuya Kikuchi, Masahiro Aoyagi:
Analysis of thermal stress distribution for TSV with novel structure. 3DIC 2014: 1-4 - Robert Fischbach, Andy Heinig, Peter Schneider:
Design rule check and layout versus schematic for 3D integration and advanced packaging. 3DIC 2014: 1-7 - Paul D. Franzon, Eric Rotenberg, James Tuck, Huiyang Zhou, W. Rhett Davis, Hongwen Dai, Joonmoo Huh, Sungkwan Ku, Steve Lipa, Chao Li, Jong Beom Park, Joshua Schabel:
3D-enabled customizable embedded computer (3DECC). 3DIC 2014: 1-3 - Takafumi Fukushima, Yuka Ito, Mariappan Murugesan, Jicheol Bea, Kang Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi:
Tiny VCSEL chip self-assembly for advanced chip-to-wafer 3D and hetero integration. 3DIC 2014: 1-4 - Armin Grünewald, Michael G. Wahl, Rainer Brück:
Manufacturing and test assistance for 3D-Integrated heterogeneous systems. 3DIC 2014: 1-6 - T. Robert Harris, Paul D. Franzon, W. Rhett Davis, Lee Wang:
Thermal effects of heterogeneous interconnects on InP / GaN / Si diverse integrated circuits. 3DIC 2014: 1-3 - Masaki Hashizume, Shoichi Umezu, Hiroyuki Yotsuyanagi, Shyue-Kung Lu:
A built-in supply current test circuit for electrical interconnect tests of 3D ICs. 3DIC 2014: 1-6 - Fumihiro Inoue, Harold Philipsen, Marleen H. van der Veen, Kevin Vandersmissen, Stefaan Van Huylenbroeck, Herbert Struyf, Tetsu Tanaka:
Cu seeding using electroless deposition on Ru liner for high aspect ratio through-Si vias. 3DIC 2014: 1-4 - Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Sukjin Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi:
Fault detection and isolation of multiple defects in through silicon via (TSV) channel. 3DIC 2014: 1-5 - Katsuya Kikuchi, Masahiro Aoyagi, Masaaki Ujiie, Shinya Takayama:
Ultrawideband ultralow PDN impedance of decoupling capacitor embedded interposers using narrow gap chip parts mounting technology for 3-D integrated LSI system. 3DIC 2014: 1-6 - Jonghoon J. Kim, Bumhee Bae, Sukjin Kim, Sunkyu Kong, Heegon Kim, Daniel H. Jung, Joungho Kim:
Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs. 3DIC 2014: 1-6 - Youngwoo Kim, Jonghyun Cho, Kiyeong Kim, Heegon Kim, Joungho Kim, Srikrishna Sitaraman, Venky Sundaram, Rao R. Tummala:
Analysis and optimization of a power distribution network in 2.5D IC with glass interposer. 3DIC 2014: 1-4 - Andrzej Kociubinski, M. Duk, Tomasz Bieniek, Grzegorz Janczyk, Michal Borecki:
Innovative SiC over Si photodiode based dual-band, 3D integrated detector. 3DIC 2014: 1-4 - Emma Kowalczuk, Arnab Bhattacharya, Ka Chung Lee, Jesse Alton, Martin Igarashi, Stephane Barbeau:
Fault localisation of defects using Electro Optical Terahertz Pulse Reflectometry and 3D EM modelling with Virtual Known Good Device. 3DIC 2014: 1-4 - K. W. Lee, Chisato Nagai, Ai Nakamura, Ji Chel Bea, Mariappan Murugesan, Takafumi Fukushima, Tanaka Tanaka, Mitsumasa Koyanagi:
Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV. 3DIC 2014: 1-4 - Keiji Matsumoto, Hiroyuki Mori, Yasumitsu Orii:
Cooling from the bottom side (laminate (substrate) side) of a three-dimensional (3D) chip stack. 3DIC 2014: 1-6 - Yoriko Mizushima, Young-Suk Kim, Tomoji Nakamura, Shoichi Kodama, Nobuhide Maeda, Koji Fujimoto, Takayuki Ohba:
Impact of Thermomechanical Stresses on Ultra-thin Si Stacked Structure. 3DIC 2014: 1-5 - Mariappan Murugesan, Takafumi Fukushima, Ji Chel Bea, K. W. Lee, Mitsu Koyanagi, Y. Imai, S. Kimura, Tetsu Tanaka:
Micro-XRD investigation of fine-pitch Cu-TSV induced thermo-mechanical stress in high-density 3D-LSI. 3DIC 2014: 1-4 - Oded Raz, Pinxiang Duan, Harm J. S. Dorren:
Simple and low cost technique for stacking known good dies to create compact 3D stacked parallel optics assemblies. 3DIC 2014: 1-4 - James F. Rohan, Declan Casey, Monika Zygowska, Michael Moore, Brian Shanahan:
Electroless metal deposition for IC and TSV applications. 3DIC 2014: 1-3 - Mehdi Saedi, Kambiz Samadi, Arpit Mittal, Rajat Mittal:
Thermal implications of mobile 3D-ICs. 3DIC 2014: 1-7 - Cristiano Santos, Papa Momar Souare, François de Crecy, Perceval Coudrain, Jean-Philippe Colonna, Pascal Vivet, Andras Borbely, Ricardo Reis, M. Haykel Ben Jamaa, Vincent Fiori, Alexis Farcy:
Using TSVs for thermal mitigation in 3D circuits: Wish and truth. 3DIC 2014: 1-8 - Cristiano Santos, Pascal Vivet, Jean-Philippe Colonna, Perceval Coudrain, Ricardo Augusto da Luz Reis:
Thermal performance of 3D ICs: Analysis and alternatives. 3DIC 2014: 1-7 - Masayuki Sato, Ryusuke Egawa, Hiroyuki Takizawa, Hiroaki Kobayashi:
On-chip checkpointing with 3D-stacked memories. 3DIC 2014: 1-6
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