"Tiny VCSEL chip self-assembly for advanced chip-to-wafer 3D and hetero ..."

Takafumi Fukushima et al. (2014)

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DOI: 10.1109/3DIC.2014.7152145

access: closed

type: Conference or Workshop Paper

metadata version: 2021-02-16

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Takafumi Fukushima, Yuka Ito, Mariappan Murugesan, Jicheol Bea, Kang Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi:
Tiny VCSEL chip self-assembly for advanced chip-to-wafer 3D and hetero integration. 3DIC 2014: 1-4

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