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"Magnetically-coupled current probing structure consisting of TSVs and RDLs ..."

Jonghoon J. Kim et al. (2014)

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DOI: 10.1109/3DIC.2014.7152151

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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  - conf/3dic/KimBKKKJK14
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  - https://dblp.org/rec/conf/3dic/KimBKKKJK14
Jonghoon J. Kim, Bumhee Bae, Sukjin Kim, Sunkyu Kong, Heegon Kim, Daniel H. Jung, Joungho Kim:
Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs. 3DIC 2014: 1-6

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