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ORCIDVincent Fiori
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2010 – 2019
- 2016
[j7]Perceval Coudrain
, Papa Momar Souare, Rafael Prieto, Vincent Fiori, Alexis Farcy, Laurent Le Pailleur, Jean-Philippe Colonna, Cristiano Santos, Pascal Vivet, M. Haykel Ben Jamaa, Denis Dutoit, François de Crecy, Sylvain Dumas, Christian Chancel, Didier Lattard, Séverine Cheramy:
Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits. IEEE Des. Test 33(3): 21-36 (2016)- [j6]Giacomo Garegnani, Vincent Fiori, Gilles Gouget, Frederic Monsieur, Clément Tavernier:
Wafer level measurements and numerical analysis of self-heating phenomena in nano-scale SOI MOSFETs. Microelectron. Reliab. 63: 90-96 (2016) - 2015
- [j5]Benjamin Vianne, Pierre Bar, Vincent Fiori, Sébastien Gallois-Garreignot, Komi-Atchou Ewuame, Pascal Chausse, Stephanie Escoubas, Nicolas Hotellier, Olivier Thomas:
Thermo-mechanical characterization of passive stress sensors in Si interposer. Microelectron. Reliab. 55(5): 738-746 (2015) - [j4]Sébastien Gallois-Garreignot, Naceur Benzima, Etienne Benmussa, Caroline Moutin, Pierre-Olivier Bouchard, Vincent Fiori, Clément Tavernier:
Qualification of bumping processes: Experimental and numerical investigations on mechanical stress and failure modes induced by shear test. Microelectron. Reliab. 55(6): 980-989 (2015) - [c4]Benjamin Vianne, Alexis Farcy, Vincent Fiori, Cédrick Chappaz, Norbert Chevrier, G. Lobascio, Pascal Chausse, F. Ponthenier, A. Ruckly, Stephanie Escoubas, Olivier Thomas:
Stress management strategy to limit die curvature during silicon interposer integration. 3DIC 2015: TS11.4.1-TS11.4.7 - 2014
- [j3]Vincent Fiori, Komi-Atchou Ewuame, Sébastien Gallois-Garreignot, Hervé Jaouen, Clément Tavernier:
Numerical analysis of thermo-mechanical and mobility effects for 28 nm node and beyond: Comparison and design consequences over bumping technologies. Microelectron. Reliab. 54(4): 764-772 (2014) - [c3]Cristiano Santos, Papa Momar Souare, François de Crecy, Perceval Coudrain, Jean-Philippe Colonna, Pascal Vivet, Andras Borbely, Ricardo Reis, M. Haykel Ben Jamaa, Vincent Fiori, Alexis Farcy:
Using TSVs for thermal mitigation in 3D circuits: Wish and truth. 3DIC 2014: 1-8 - 2013
- [j2]Vincent Fiori, Sébastien Gallois-Garreignot, Hervé Jaouen, Clément Tavernier:
Strain engineering for bumping over IPs: Numerical investigations of thermo-mechanical stress induced mobility variations for CMOS 32 nm and beyond. Microelectron. Reliab. 53(2): 229-235 (2013) - [c2]Papa Momar Souare, François de Crecy, Vincent Fiori, M. Haykel Ben Jamaa, Alexis Farcy, Sébastien Gallois-Garreignot, Andras Borbely, Jean-Philippe Colonna, Perceval Coudrain, B. Giraud, C. Laviron, Séverine Cheramy, Clément Tavernier, Jean Michailos:
Thermal correlation between measurements and FEM simulations in 3D ICs. 3DIC 2013: 1-6 - [c1]Benjamin Vianne, Pierre Bar, Vincent Fiori, Sebastien Petitdidier, Norbert Chevrier, Sébastien Gallois-Garreignot, Alexis Farcy, Pascal Chausse, Stephanie Escoubas, Nicolas Hotellier, Olivier Thomas:
Thermo-mechanical study of a 2.5D passive silicon interposer technology: Experimental, numerical and In-Situ stress sensors developments. 3DIC 2013: 1-7 - 2010
- [j1]Sébastien Gallois-Garreignot, Vincent Fiori, D. Nelias:
Fracture phenomena induced by Front-End/Back-End interactions: Dedicated failure analysis and numerical developments. Microelectron. Reliab. 50(1): 75-85 (2010)
Coauthor Index
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