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"Cooling from the bottom side (laminate (substrate) side) of a ..."
Keiji Matsumoto, Hiroyuki Mori, Yasumitsu Orii (2014)
- Keiji Matsumoto, Hiroyuki Mori, Yasumitsu Orii:
Cooling from the bottom side (laminate (substrate) side) of a three-dimensional (3D) chip stack. 3DIC 2014: 1-6
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