- Akihiro Ikeda, Naoya Watanabe, Tanemasa Asano:
High frequency signal transmission characteristics of cone bump interconnections. 3DIC 2011: 1-5 - Katsuyuki Ikeuchi, Makoto Takamiya, Takayasu Sakurai:
Through Silicon Capacitive Coupling (TSCC) interface for 3D stacked dies. 3DIC 2011: 1-5 - Fumihiro Inoue, Harold Philipsen, Alex Radisic, Silvia Armini, Peter Leunissen, Hiroshi Miyake, Ryohei Arima, Tomohiro Shimizu, Toshiaki Ito, Hirofumi Seki, Yuko Shinozaki, Tomohiko Yamamoto, Shoso Shingubara:
Low temperature through-Si via fabrication using electroless deposition. 3DIC 2011: 1-4 - Hideaki Ishihara:
Evolutional Directions of Smart Automotive Systems and Semiconductors. 3DIC 2011: 1 - Toshiaki Itabashi, Masashi Kotani, Melvin P. Zussman, K. Zoschke, T. Fischer, M. Topper, Hiroyuki Ishida:
High temperature bonding solutions enabling thin wafer process and handling on 3D-IC manufacturing. 3DIC 2011: 1-4 - Yuka Ito, Shinsuke Terada, Shinya Arai, Koji Choki, Takafumi Fukushima, Mitsumasa Koyanagi:
High-bandwidth data transmission of new transceiver module through optical interconnection. 3DIC 2011: 1-4 - Andrej Ivankovic, Geert Van der Plas, V. Moroz, M. Choi, Vladimir Cherman, Abdelkarim Mercha, Paul Marchal, Marcel Gonzalez, Geert Eneman, Wenqi Zhang, Thibault Buisson, Mikael Detalle, Antonio La Manna, Diederik Verkest, Gerald Beyer, Eric Beyne, Bart Vandevelde, Ingrid De Wolf, Dirk Vandepitte:
Analysis of microbump induced stress effects in 3D stacked IC technologies. 3DIC 2011: 1-5 - Mohamad Hairol Jabbar, Dominique Houzet, Omar Hammami:
3D multiprocessor with 3D NoC architecture based on Tezzaron technology. 3DIC 2011: 1-5 - Sinwoo Kang, Sungdong Cho, Kiyoung Yun, Sangwook Ji, Kisoon Bae, Woonseob Lee, Eunji Kim, Jangho Kim, Jonghoon Cho, Hyongyol Mun, Yeong L. Park:
TSV optimization for BEOL interconnection in logic process. 3DIC 2011: 1-4 - Sung-Geun Kang, Youngrae Kim, Eun-Sol Kim, Naeun Lim, Teakgyu Jeong, Jieun Lee, Sarah Eunkyung Kim, Sungdong Kim:
Evaluation of wafer level Cu bonding for 3D integration. 3DIC 2011: 1-2 - Fumiki Kato, Katsuya Kikuchi, Hiroshi Nakagawa, Masahiro Aoyagi:
Hot spots suppression by high thermal conductivity film in thin-sub strate CMOS ICs for 3D integration. 3DIC 2011: 1-4 - Won-Myoung Ki, Myong-Suk Kang, Sehoon Yoo, Chang-Woo Lee:
Fabrication and bonding process of fine pitch Cu pillar bump on thin Si chip for 3D stacking IC. 3DIC 2011: 1-4 - Katsuya Kikuchi, Chihiro Ueda, Fumiaki Fujii, Yutaka Akiyama, Naoya Watanabe, Yasuhiro Kitamura, Toshio Gomyo, Toshikazu Okubo, Tetsuya Koyama, Tadashi Kamada, Masahiro Aoyagi, Kanji Otsuka:
PDN impedance analysis of TSV-decoupling capacitor embedded Silicon interposer for 3D-integrated CMOS image sensor system. 3DIC 2011: 1-4 - Kosuke Kitaichi, Haruo Shimamoto, Chuichi Miyazaki, Yoshiyuki Abe, Sigeaki Saito, Shoji Yasunaga:
Development of high accuracy wafer thinning and pickup technology for thin wafer. 3DIC 2011: 1-5 - Kouji Kiyoyama, Kang Wook Lee, Takafumi Fukushima, H. Naganuma, H. Kobayashi, Tetsu Tanaka, Mitsumasa Koyanagi:
A very low area ADC for 3-D stacked CMOS image processing system. 3DIC 2011: 1-4 - Cheng-Ta Ko, Zhi-Cheng Hsiao, Y. J. Chang, Peng-Shu Chen, J. H. Huang, Hsin-Chia Fu, Y. J. Huang, C. W. Chiang, W. L. Tsat, Y. H. Chen, Wei-Chung Lo, Kuan-Neng Chen:
Wafer-level 3D integration with Cu TSV and micro-bump/adhesive hybrid bonding technologies. 3DIC 2011: 1-4 - Young-Ki Ko, Myong-Suk Kang, Hiroyuki Kokawa, Yutaka S. Sato, Sehoon Yoo, Chang-Woo Lee:
Advanced TSV filling method with Sn alloy and its reliability. 3DIC 2011: 1-4 - Sayuri Kohara, Akihiro Horibe, Kuniaki Sueoka, Keiji Matsumoto, Fumiaki Yamada, Yasumitsu Orii, Katsuyuki Sakuma, Takahiro Kinoshita, Takashi Kawakami:
Thermal stress analysis of die stacks with fine-pitch IMC interconnections for 3D integration. 3DIC 2011: 1-7 - Tomoaki Konishi, Hiroyuki Yotsuyanagi, Masaki Hashizume:
Supply current testing of open defects at interconnects in 3D Ics with IEEE 1149.1 architecture. 3DIC 2011: 1-6 - Byung-Hyun Kwak, Sung-Hyuk Kim, Young-Bae Park:
Current stressing effect on interfacial reaction characteristics of Cu pillar/Sn-3.5Ag microbumps for 3D integration. 3DIC 2011: 1-2 - Nam Hee Kwon, S. M. Hong, Yong-Won Cha, Sun Jae Lee, Han Gyul Lee, Areum Kim, Soo Won Kim, Chang Hyun Kim, Sung Gyu Pyo:
Effect of planarity on the 3D integration in 3-D integrated CMOS image sensor. 3DIC 2011: 1-3 - John H. Lau:
Recent advances and new trends in nanotechnology and 3D integration for semiconductor industry. 3DIC 2011: 1-23 - Kang Wook Lee, Jichoel Bea, Takafumi Fukushima, Yuki Ohara, Tetsu Tanaka, Mitsumasa Koyanagi:
High reliable and fine size of 5-μm diameter backside Cu through-silicon Via(TSV) for high reliability and high-end 3-D LSIs. 3DIC 2011: 1-4 - Gyujei Lee, Suk-woo Jeon, Kwang-yoo Byun, Dongil Kwon:
Mechanical characterization of residual stress around TSV through instrumented indentation algorithm. 3DIC 2011: 1-6 - Jae Hak Lee, Choong D. Yoo, Jun-Yeob Song, Seung S. Lee, Sun-Rak Kim:
A study on the edge traces technique for 3D stack chip. 3DIC 2011: 1-4 - H. Y. Li, L. Xie, L. G. Ong, A. Baram, I. Herer, Arnon Hirshberg, S. C. Chong, D. L. Kwong:
Ultra-compact micro-coil realized via multilevel dense TSV coil for MEMs application. 3DIC 2011: 1-4 - Xiongfei Liao, Jun Zhou, Xin Liu:
Exploring AMBA AXI on-Chip interconnection for TSV-based 3D SoCs. 3DIC 2011: 1-4 - Dau Fatt Lim, K. C. Leong, Chuan Seng Tan:
Selection of underfill material in Cu hybrid bonding and its effect on the transistor keep-out-zone. 3DIC 2011: 1-4 - Hong-Yeol Lim, Gi-Ho Park:
Adaptive prefetching scheme for exploiting massive memory bandwidth of 3-D IC technology. 3DIC 2011: 1-5 - Xin Liu, Lei Wang, Mini Jayakrishnan, Jingjing Lan, Hongyu Li, Chong Ser Choong, M. Kumarasamy Raja, Yongxin Guo, Wang Ling Goh, Jin He, Shan Gao, Minkyu Je:
A miniaturized heterogeneous wireless sensor node in 3DIC. 3DIC 2011: 1-4