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"Wafer-level 3D integration with Cu TSV and micro-bump/adhesive hybrid ..."
Cheng-Ta Ko et al. (2011)
- Cheng-Ta Ko, Zhi-Cheng Hsiao, Y. J. Chang, Peng-Shu Chen, J. H. Huang, Hsin-Chia Fu, Y. J. Huang, C. W. Chiang, W. L. Tsat, Y. H. Chen, Wei-Chung Lo, Kuan-Neng Chen
:
Wafer-level 3D integration with Cu TSV and micro-bump/adhesive hybrid bonding technologies. 3DIC 2011: 1-4
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