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"Ultra-compact micro-coil realized via multilevel dense TSV coil for MEMs ..."

H. Y. Li et al. (2011)

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DOI: 10.1109/3DIC.2012.6263008

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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H. Y. Li, L. Xie, L. G. Ong, A. Baram, I. Herer, Arnon Hirshberg, S. C. Chong, D. L. Kwong:
Ultra-compact micro-coil realized via multilevel dense TSV coil for MEMs application. 3DIC 2011: 1-4

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