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"Fabrication and bonding process of fine pitch Cu pillar bump on thin Si ..."

Won-Myoung Ki et al. (2011)

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DOI: 10.1109/3DIC.2012.6263016

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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Won-Myoung Ki, Myong-Suk Kang, Sehoon Yoo, Chang-Woo Lee:
Fabrication and bonding process of fine pitch Cu pillar bump on thin Si chip for 3D stacking IC. 3DIC 2011: 1-4

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