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"Current stressing effect on interfacial reaction characteristics of Cu ..."

Byung-Hyun Kwak, Sung-Hyuk Kim, Young-Bae Park (2011)

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DOI: 10.1109/3DIC.2012.6263004

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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  dblp key:
  - conf/3dic/KwakKP11
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Byung-Hyun Kwak, Sung-Hyuk Kim, Young-Bae Park:
Current stressing effect on interfacial reaction characteristics of Cu pillar/Sn-3.5Ag microbumps for 3D integration. 3DIC 2011: 1-2

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