"High reliable and fine size of 5-μm diameter backside Cu ..."

Kang Wook Lee et al. (2011)

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DOI: 10.1109/3DIC.2012.6262975

access: closed

type: Conference or Workshop Paper

metadata version: 2021-02-16

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Kang Wook Lee, Jichoel Bea, Takafumi Fukushima, Yuki Ohara, Tetsu Tanaka, Mitsumasa Koyanagi:
High reliable and fine size of 5-μm diameter backside Cu through-silicon Via(TSV) for high reliability and high-end 3-D LSIs. 3DIC 2011: 1-4

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