- Nobuhide Maeda, Young-Suk Kim, Y. Hikosaka, T. Eshita, Hideki Kitada, K. Fujimoto, Yoriko Mizushima, K. Suzuki, Tadao Nakamura, Akihito Kawai, Kazuhisa Arai, Takayuki Ohba:
Development of ultra-thinning technology for logic and memory heterogeneous stack applications. 3DIC 2011: 1-4 - Antonio La Manna, Dimitrios Velenis, Thibault Buisson, Mikael Detalle, Kenneth J. Rebibis, Wenqi Zhang, Eric Beyne
:
3D stacking using ultra thin dies. 3DIC 2011: 1-5 - Farhad Mehdipour, Krishna Chaitanya Nunna, Lovic Gauthier, Koji Inoue, Kazuaki J. Murakami:
A thermal-aware mapping algorithm for reducing peak temperature of an accelerator deployed in a 3D stack. 3DIC 2011: 1-4 - Sebastien Mermoz, Loic Sanchez, Léa Di Cioccio, Jean Berthier, Emilie Deloffre, Christian Fretigny:
Impact of containment and deposition method on sub-micron chip-to-wafer self-assembly yield. 3DIC 2011: 1-5 - Xiaoyu Mi, Osamu Toyoda, Satoshi Ueda, Fumihiko Nakazawa:
A 3D heterogeneous integration method using LTCC wafer for RF applications. 3DIC 2011: 1-5 - Seyyed Hasan Moallempour, Seyyed Ahmad Razavi, Morteza Saheb Zamani
:
TSV reduction in homogeneous 3D FPGAs by logic resource and input pad replication. 3DIC 2011: 1-5 - Hans-Günther Moser, Ladislav Andricek
, Michael Beimforde, G. Liemann, Anna Macchiolo, Richard Nisius, Rainer Helmut Richter, Philipp Weigell:
Development of pixel detectors for particle physics using SLID-ICV interconnection technology. 3DIC 2011: 1-4 - Makoto Motoyoshi, Junichi Takanohashi, Takafumi Fukushima
, Yasuo Arai, Mitsumasa Koyanagi:
Stacked SOI pixel detector using versatile fine pitch μ-bump technology. 3DIC 2011: 1-4 - Mariappan Murugesan, Hideto Hashiguchi, Harufumi Kobayashi, Takafumi Fukushima
, Tetsu Tanaka
, Mitsumasa Koyanagi:
W/Cu TSVs for 3D-LSI with minimum thermo-mechanical stress. 3DIC 2011: 1-4 - Mariappan Murugesan, Harufumi Kobayashi, Takafumi Fukushima
, Tetsu Tanaka
, Mitsumasa Koyanagi:
High density Cu-TSVs and reliability issues. 3DIC 2011: 1-4 - Revanth Nadipalli, Ji Fan, Holden King Ho Li
, Keng Hoong Wee, Hao Yu, Chuan Seng Tan
:
3D integration of MEMS and CMOS via Cu-Cu bonding with simultaneous formation of electrical, mechanical and hermetic bonds. 3DIC 2011: 1-5 - Kota Nakahira, Fumiaki Endo, Ryosuke Furuya, Ken Suzuki
, Hideo Miura:
Minimization of the local residual stress in 3DICs by controlling the structures and mechanical properties of 3D interconnections. 3DIC 2011: 1-6 - Tomoji Nakamura, Hideki Kitada, Yoriko Mizushima, Nobuhide Maeda, Koji Fujimoto, Takayuki Ohba:
Comparative study of side-wall roughness effects on leakage currents in through-silicon via interconnects. 3DIC 2011: 1-4 - Osamu Nakatsuka
, Hideki Kitada, Young-Suk Kim, Yoriko Mizushima, Tomoji Nakamura, Takayuki Ohba, Shigeaki Zaima
:
Characterization of local strain around trough silicon via interconnects in wafer-on-wafer structures. 3DIC 2011: 1-4 - Fumihiko Nakazawa, Takeaki Shimanouchi, Tadashi Nakatani, Takashi Katsuki, Hisao Okuda, Osamu Toyoda, Satoshi Ueda:
Effect of frequency in the 3D integration of a PZT-actuated MEMS switch using a single crystal silicon asymmetric beam. 3DIC 2011: 1-5 - Brandon Noia, Krishnendu Chakrabarty
:
Pre-bond testing of die logic and TSVs in high performance 3D-SICs. 3DIC 2011: 1-5 - Akihiro Noriki, Kang Wook Lee, Jichoel Bea, Takafumi Fukushima
, Tetsu Tanaka, Mitsumasa Koyanagi:
Fabrication tolerance evaluation of high efficient unidirectional optical coupler for though silicon photonic via in optoelectronic 3D-LSI. 3DIC 2011: 1-4 - Yuki Ohara, Kang Wook Lee, Takafumi Fukushima
, Tetsu Tanaka
, Mitsumasa Koyanagi:
Novel detachable bonding process with wettability control of bonding surface for versatile chip-level 3D integration. 3DIC 2011: 1-4 - Yoshiaki Oizono, Yoshitaka Nabeshima, Takafumi Okumura, Toshio Sudo, Atsushi Sakai, Shiro Uchiyama, Hiroaki Ikeda:
PDN impedance and SSO noise simulation of 3D system-in-package with a widebus structure. 3DIC 2011: 1-2 - Akiko Okada, Masatsugu Nimura, Naoko Unami, Akitsu Shigetou, Hirokazu Noma
, Katsuyuki Sakuma
, Jun Mizuno, Shuichi Shoji:
Low temperature Au-Au bonding with VUV/O3 treatment. 3DIC 2011: 1-5 - Stephen Olson, Klaus Hummler:
TSV reveal etch for 3D integration. 3DIC 2011: 1-4 - Alain Phommahaxay, Anne Jourdain, Greet Verbinnen, Tobias Woitke, Peter Bisson, Markus Gabriel, Walter Spiess, Alice Guerrero, Jeremy McCutcheon, Rama Puligadda, Pieter Bex, Axel Van den Eede, Bart Swinnen, Gerald Beyer, Andy Miller, Eric Beyne
:
Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding. 3DIC 2011: 1-4 - Shivam Priyadarshi, Jianchen Hu, Won Ha Choi, Samson Melamed
, Xi Chen, W. Rhett Davis
, Paul D. Franzon
:
Pathfinder 3D: A flow for system-level design space exploration. 3DIC 2011: 1-8 - Artur Quiring, Marc Lindenberg, Markus Olbrich, Erich Barke:
3D floorplanning considering vertically aligned rectilinear modules using T∗-tree. 3DIC 2011: 1-5 - Elyse Rosenbaum, Vrashank Shukla, Min-Sun Keel:
ESD protection networks for 3D integrated circuits. 3DIC 2011: 1-7 - Naoki Saito, Naokazu Murata, Kinji Tamakawa, Ken Suzuki
, Hideo Miura:
Mechanical and electrical reliability of copper interconnections for 3DIC. 3DIC 2011: 1-6 - Kazuta Saito, Richard J. Webb, Blake R. Dronen:
Advances of 3M™ wafer support system. 3DIC 2011: 1-4 - Ryohei Sato, Akihiro Tsukada, Yukihiro Sato, Yoshiharu Iwata, Hidenori Murata, Shigenobu Sekine, Ryuji Kimura, Keijiroh Kishi:
Study on high performance and productivity of TSV's with new filling method and alloy for advanced 3D-SiP. 3DIC 2011: 1-4 - Deepak C. Sekar, Zvi Or-Bach:
Monolithic 3D-ICs with single crystal silicon layers. 3DIC 2011: 1-2 - Takanori Shuto, Naoya Watanabe, Akihiro Ikeda, Tanemasa Asano:
Low-temperature bonding of LSI chips to PEN film using Au cone bump for heterogeneous integration. 3DIC 2011: 1-4