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"Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ..."

Alain Phommahaxay et al. (2011)

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DOI: 10.1109/3DIC.2012.6262943

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-14

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  - conf/3dic/PhommahaxayJVWBGSGMPBESBMB11
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  - https://dblp.org/rec/conf/3dic/PhommahaxayJVWBGSGMPBESBMB11
Alain Phommahaxay, Anne Jourdain, Greet Verbinnen, Tobias Woitke, Peter Bisson, Markus Gabriel, Walter Spiess, Alice Guerrero, Jeremy McCutcheon, Rama Puligadda, Pieter Bex, Axel Van den Eede, Bart Swinnen, Gerald Beyer, Andy Miller, Eric Beyne:
Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding. 3DIC 2011: 1-4

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