"Pre-bond testing of die logic and TSVs in high performance 3D-SICs."

Brandon Noia, Krishnendu Chakrabarty (2011)

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DOI: 10.1109/3DIC.2012.6263042

access: closed

type: Conference or Workshop Paper

metadata version: 2022-01-03

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Brandon Noia, Krishnendu Chakrabarty:
Pre-bond testing of die logic and TSVs in high performance 3D-SICs. 3DIC 2011: 1-5

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