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"Permanent wafer bonding in the low temperature by using various plasma ..."
Soon-Wook Kim et al. (2015)
- Soon-Wook Kim, Lan Peng, Andy Miller, Gerald Beyer, Eric Beyne
, Chung-Sun Lee:
Permanent wafer bonding in the low temperature by using various plasma enhanced chemical vapour deposition dielectrics. 3DIC 2015: TS7.2.1-TS7.2.4
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