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"Extreme wafer thinning optimization for via-last applications."

Anne Jourdain et al. (2016)

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DOI: 10.1109/3DIC.2016.7970028

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-14

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  dblp key:
  - conf/3dic/JourdainVIRMBBW16
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  persistent URL:
  - https://dblp.org/rec/conf/3dic/JourdainVIRMBBW16
Anne Jourdain, Joeri De Vos, Fumihiro Inoue, Kenneth J. Rebibis, Andy Miller, Gerald Beyer, Eric Beyne, Edward Walsby, Jash Patel, Oliver Ansell, Janet Hopkins, Huma Ashraf, Dave Thomas:
Extreme wafer thinning optimization for via-last applications. 3DIC 2016: 1-5

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