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ORCIDTed R. Lundquist
Person information
- affiliation: DCG Systems Inc., Fremont, USA
- affiliation: NPTest Inc., San Jose, USA
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2010 – 2019
- 2016
[j12]Marius Rutkauskas, Carl Farrell, Christophe Dorrer
, Kara L. Marshall, Tom Crawford, Ted R. Lundquist, P. Vedagarbha, K. Erington, D. Bodoh, Derryck Telford Reid:
Two-photon laser-assisted device alteration in CMOS integrated circuits using linearly, circularly and radially polarized light. Microelectron. Reliab. 60: 62-66 (2016)- 2015
- [c6]Andrea Bahgat Shehata, Alan J. Weger, Franco Stellari, Peilin Song, Hervé Deslandes, Ted R. Lundquist, Euan Ramsay:
Time-integrated photon emission as a function of temperature in 32 nm CMOS. IRPS 2015: 2 - 2014
- [j11]Philipp Scholz, Norbert Herfurth, Michael Sadowski, Ted R. Lundquist, Uwe Kerst, Christian Boit:
Efficient and flexible Focused Ion Beam micromachining of Solid Immersion Lenses in various bulk semiconductor materials - An adaptive calibration algorithm. Microelectron. Reliab. 54(9-10): 1794-1797 (2014) - 2011
- [j10]Cathy Kardach, I. Kapilevich, Jeffrey A. Block, Ted R. Lundquist, Steven Kasapi, J. Liao, Yin S. Ng, Bruce Cory:
Foundry workflow for dynamic-EFA-based yield ramp. Microelectron. Reliab. 51(9-11): 1668-1672 (2011) - 2010
- [j9]Philipp Scholz, Christian Gallrapp, Uwe Kerst, Ted R. Lundquist, Christian Boit:
Optimizing focused ion beam created solid immersion lenses in bulk silicon using design of experiments. Microelectron. Reliab. 50(9-11): 1441-1445 (2010) - [j8]Rudolf Schlangen, Hervé Deslandes, Ted R. Lundquist, C. Schmidt, Frank Altmann, K. Yu, A. Andreasyan, S. Li:
Dynamic lock-in thermography for operation mode-dependent thermally active fault localization. Microelectron. Reliab. 50(9-11): 1454-1458 (2010)
2000 – 2009
- 2009
- [j7]Joy Y. Liao, Tung Ton, Nathan Slattengren, Steven Kasapi, William K. Lo, Howard L. Marks, Yin S. Ng, Ted R. Lundquist:
Jitter analysis of PLL-generated clock propagation using Jitter Mitigation techniques with laser voltage probing. Microelectron. Reliab. 49(9-11): 1127-1131 (2009) - [j6]Rudolf Schlangen, Reiner Leihkauf, Uwe Kerst, Ted R. Lundquist, Peter Egger, Christian Boit:
Physical analysis, trimming and editing of nanoscale IC function with backside FIB processing. Microelectron. Reliab. 49(9-11): 1158-1164 (2009) - 2008
- [j5]Christian Boit, Rudolf Schlangen, Uwe Kerst, Ted R. Lundquist:
Physical Techniques for Chip-Backside IC Debug in Nanotechnologies. IEEE Des. Test Comput. 25(3): 250-257 (2008) - 2007
- [j4]Rudolf Schlangen, Uwe Kerst, Christian Boit, Tahir Malik, Rajesh Jain, Ted R. Lundquist:
Non destructive 3D chip inspection with nano scale potential by use of backside FIB and backscattered electron microscopy. Microelectron. Reliab. 47(9-11): 1523-1528 (2007) - [c5]Rudolf Schlangen, Reiner Leihkauf, Uwe Kerst, Christian Boit, Rajesh Jain, Tahir Malik, Keneth R. Wilsher, Ted R. Lundquist, Bernd Krüger:
Backside E-Beam Probing on Nano scale devices. ITC 2007: 1-9 - 2005
- [c4]Uwe Kerst, Rudolf Schlangen, A. Kabakow, Erwan Le Roy, Ted R. Lundquist, Siegfried Pauthner:
Impact of back side circuit edit on active device performance in bulk silicon ICs. ITC 2005: 9 - 2003
- [j3]Hervé Deslandes, Ted R. Lundquist:
Limitations to photon-emission microscopy when applied to "hot" devices. Microelectron. Reliab. 43(9-11): 1645-1650 (2003) - [c3]Romain Desplats, Felix Beaudoin, Philippe Perdu, Nagamani Nataraj, Ted R. Lundquist, Ketan Shah:
Fault Localization using Time Resolved Photon Emission and STIL Waveforms. ITC 2003: 254-263 - 2002
- [j2]Chun-Cheng Tsao, Bill Thompson, Ted R. Lundquist:
Imaging and Material Analysis from Sputter-Induced Light Emission Using Coaxial Ion-Photon Column. Microelectron. Reliab. 42(9-11): 1667-1672 (2002) - [c2]Madhumita Sengupta, Lokesh Johri, Chun-Cheng Tsao, Mark Thompson, Ted R. Lundquist:
Subresolution placement using IR image to CAD database alignment: an algorithm for silicon-side probing. Image Processing: Algorithms and Systems 2002: 449-459 - 2001
- [j1]Ted R. Lundquist, E. Delenia, J. Harroun, E. LeRoy, Chun-Cheng Tsao:
Ultra-Thinning of C4 Integrated Circuits for Backside Analysis during First Silicon Debug. Microelectron. Reliab. 41(9-10): 1545-1549 (2001) - [c1]G. Dajee, Norman Goldblatt, Ted R. Lundquist, Steven Kasapi, Keneth R. Wilsher:
Practical, non-invasive optical probing for flip-chip devices. ITC 2001: 433-442
Coauthor Index
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