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2020 – today
- 2023
[c11]Mohamed Naeim
, Hanqi Yang, Pinhong Chen, Rong Bao, Antoine Dekeyser, Giuliano Sisto, Moritz Brunion, Rongmei Chen, Geert Van der Plas, Eric Beyne, Dragomir Milojevic:
Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs. 3DIC 2023: 1-4- [c10]Baohui Xu, Rongmei Chen, Jie Liang:
A Modeling Study: Applying Carbon-Based Interconnects to BS-PDN Architecture. ASICON 2023: 1-4 - [c9]Devin Verreck, Piet Wambacq, Maarten Van De Put, Zubair Ahmed, Quentin Smets, Aryan Afzalian, Rutger Duflou, Xiangyu Wu, Gioele Mirabelli, Rongmei Chen, Inge Asselberghs, Gouri Sankar Kar:
The Promise of 2-D Materials for Scaled Digital and Analog Applications. ISSCC 2023: 394-395 - [c8]Giuliano Sisto, R. Preston, Rongmei Chen, Gioele Mirabelli, Anita Farokhnejad, Yun Zhou, Ivan Ciofi, Anne Jourdain, A. Veloso, Michele Stucchi, Odysseas Zografos, Pieter Weckx, Geert Hellings, Julien Ryckaert:
Block-level Evaluation and Optimization of Backside PDN for High-Performance Computing at the A14 node. VLSI Technology and Circuits 2023: 1-2 - 2022
- [j6]Rongmei Chen, Lin Chen, Jie Liang, Yuanqing Cheng, Souhir Elloumi, Jaehyun Lee, Kangwei Xu, Vihar P. Georgiev, Kai Ni, Peter Debacker, Asen Asenov, Aida Todri-Sanial:
Carbon Nanotube SRAM in 5-nm Technology Node Design, Optimization, and Performance Evaluation - Part I: CNFET Transistor Optimization. IEEE Trans. Very Large Scale Integr. Syst. 30(4): 432-439 (2022) - [j5]Rongmei Chen, Lin Chen, Jie Liang, Yuanqing Cheng, Souhir Elloumi, Jaehyun Lee, Kangwei Xu, Vihar P. Georgiev, Kai Ni, Peter Debacker, Asen Asenov, Aida Todri-Sanial:
Carbon Nanotube SRAM in 5-nm Technology Node Design, Optimization, and Performance Evaluation - Part II: CNT Interconnect Optimization. IEEE Trans. Very Large Scale Integr. Syst. 30(4): 440-448 (2022) - [c7]Anabela Veloso, Geert Eneman, An De Keersgieter, P. Favia, Andriy Hikavyy, Rongmei Chen, Anne Jourdain, N. Horiguchi:
Innovations in Transistor Architecture and Device Connectivity for Advanced Logic Scaling. ICICDT 2022: 51-54 - [c6]Rongmei Chen, Giuliano Sisto, Odysseas Zografos, Dragomir Milojevic, Pieter Weckx, Geert Van der Plas, Eric Beyne:
Opportunities of Chip Power Integrity and Performance Improvement through Wafer Backside (BS) Connection: Invited Paper. SLIP 2022: 3:1-3:5 - [c5]Anabela Veloso, Anne Jourdain, D. Radisic, Rongmei Chen, G. Arutchelvan, B. O'Sullivan, Hiroaki Arimura, Michele Stucchi, An De Keersgieter, M. Hosseini, T. Hopf, K. D'Have, S. Wang, E. Dupuy, G. Mannaert, Kevin Vandersmissen, S. Iacovo, P. Marien, S. Choudhury, F. Schleicher, F. Sebaai, Yusuke Oniki, X. Zhou, A. Gupta, Tom Schram, B. Briggs, C. Lorant, E. Rosseel, Andriy Hikavyy, Roger Loo, J. Geypen, D. Batuk, G. T. Martinez, J. P. Soulie, Katia Devriendt, B. T. Chan, S. Demuynck, Gaspard Hiblot, Geert Van der Plas, Julien Ryckaert, Gerald Beyer, E. Dentoni Litta, Eric Beyne, Naoto Horiguchi:
Scaled FinFETs Connected by Using Both Wafer Sides for Routing via Buried Power Rails. VLSI Technology and Circuits 2022: 284-285 - [c4]Rongmei Chen, Giuliano Sisto, Michele Stucchi, Anne Jourdain, Kenichi Miyaguchi, Pieter Schuddinck, P. Woeltgens, H. Lin, Naveen Kakarla, Anabela Veloso, Dragomir Milojevic, Odysseas Zografos, Pieter Weckx, Geert Hellings, Geert Van der Plas, Julien Ryckaert, Eric Beyne:
Backside PDN and 2.5D MIMCAP to Double Boost 2D and 3D ICs IR-Drop beyond 2nm Node. VLSI Technology and Circuits 2022: 429-430 - 2021
- [c3]Giuliano Sisto, Rongmei Chen, Richard Chou, Geert Van der Plas, Eric Beyne, Rod Metcalfe, Dragomir Milojevic:
Design And Sign-off Methodologies For Wafer-To-Wafer Bonded 3D-ICs At Advanced Nodes (invited). SLIP 2021: 17-23 - 2020
- [j4]Rongmei Chen, Siyuan Chen:
Online Cooperative Teaching Mode Based on Self-Direction Theory in Method of Sport Science Research. Int. J. Emerg. Technol. Learn. 15(22): 24-38 (2020)
2010 – 2019
- 2019
- [c2]Giuliano Sisto, Peter Debacker, Rongmei Chen, Geert Van der Plas, Richard Chou, Eric Beyne, Dragomir Milojevic:
Design Enablement of Fine Pitch Face-to-Face 3D System Integration using Die-by-Die Place & Route. 3DIC 2019: 1-4 - 2018
- [j3]Lili Ding, Wei Chen, Hongxia Guo, Tan Wang, Rongmei Chen, Yinhong Luo, Fengqi Zhang, Xiaoyu Pan:
Modeling the impact of well contacts on SEE response with bias-dependent Single-Event compact model. Microelectron. Reliab. 81: 337-341 (2018) - [j2]Wen Zhao, Chaohui He, Wei Chen, Rongmei Chen, Peitian Cong, Fengqi Zhang, Zujun Wang, Chen Shen, Lisang Zheng, Xiaoqiang Guo, Lili Ding:
Single-event multiple transients in guard-ring hardened inverter chains of different layout designs. Microelectron. Reliab. 87: 151-157 (2018) - 2017
- [j1]Rongmei Chen, Wei Chen, Xiaoqiang Guo, Chen Shen, Fengqi Zhang, Lisang Zheng, Wen Zhao, Lili Ding, Yinhong Luo, Hongxia Guo, Yuanming Wang, Yinong Liu:
Improved on-chip self-triggered single-event transient measurement circuit design and applications. Microelectron. Reliab. 71: 99-105 (2017) - 2016
- [c1]Rongmei Chen, Enxia Zhang, Bharat L. Bhuva:
Single-event performance of differential flip-flop designs and hardening implication. IOLTS 2016: 221-226
Coauthor Index
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