"Backside PDN and 2.5D MIMCAP to Double Boost 2D and 3D ICs IR-Drop beyond ..."

Rongmei Chen et al. (2022)

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DOI: 10.1109/VLSITECHNOLOGYANDCIR46769.2022.9830328

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-30

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Rongmei Chen, Giuliano Sisto, Michele Stucchi, Anne Jourdain, Kenichi Miyaguchi, Pieter Schuddinck, P. Woeltgens, H. Lin, Naveen Kakarla, Anabela Veloso, Dragomir Milojevic, Odysseas Zografos, Pieter Weckx, Geert Hellings, Geert Van der Plas, Julien Ryckaert, Eric Beyne:
Backside PDN and 2.5D MIMCAP to Double Boost 2D and 3D ICs IR-Drop beyond 2nm Node. VLSI Technology and Circuits 2022: 429-430

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