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ORCIDSébastien Gallois-Garreignot
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2010 – 2019
- 2018
[j6]Thomas Wlanis, René Hammer
, Werner Ecker, Sandrine Lhostis, Clément Sart, Sébastien Gallois-Garreignot, Bernhard Rebhan, Günther A. Maier:
Cu-SiO2 hybrid bonding simulation including surface roughness and viscoplastic material modeling: A critical comparison of 2D and 3D modeling approach. Microelectron. Reliab. 86: 1-9 (2018)- 2015
- [j5]Benjamin Vianne, Pierre Bar, Vincent Fiori, Sébastien Gallois-Garreignot, Komi-Atchou Ewuame, Pascal Chausse, Stephanie Escoubas, Nicolas Hotellier, Olivier Thomas:
Thermo-mechanical characterization of passive stress sensors in Si interposer. Microelectron. Reliab. 55(5): 738-746 (2015) - [j4]Sébastien Gallois-Garreignot, Naceur Benzima, Etienne Benmussa, Caroline Moutin, Pierre-Olivier Bouchard, Vincent Fiori, Clément Tavernier:
Qualification of bumping processes: Experimental and numerical investigations on mechanical stress and failure modes induced by shear test. Microelectron. Reliab. 55(6): 980-989 (2015) - 2014
- [j3]Vincent Fiori, Komi-Atchou Ewuame, Sébastien Gallois-Garreignot, Hervé Jaouen, Clément Tavernier:
Numerical analysis of thermo-mechanical and mobility effects for 28 nm node and beyond: Comparison and design consequences over bumping technologies. Microelectron. Reliab. 54(4): 764-772 (2014) - 2013
- [j2]Vincent Fiori, Sébastien Gallois-Garreignot, Hervé Jaouen, Clément Tavernier:
Strain engineering for bumping over IPs: Numerical investigations of thermo-mechanical stress induced mobility variations for CMOS 32 nm and beyond. Microelectron. Reliab. 53(2): 229-235 (2013) - [c2]Papa Momar Souare, François de Crecy, Vincent Fiori, M. Haykel Ben Jamaa, Alexis Farcy, Sébastien Gallois-Garreignot, Andras Borbely, Jean-Philippe Colonna, Perceval Coudrain, B. Giraud, C. Laviron, Séverine Cheramy, Clément Tavernier, Jean Michailos:
Thermal correlation between measurements and FEM simulations in 3D ICs. 3DIC 2013: 1-6 - [c1]Benjamin Vianne, Pierre Bar, Vincent Fiori, Sebastien Petitdidier, Norbert Chevrier, Sébastien Gallois-Garreignot, Alexis Farcy, Pascal Chausse, Stephanie Escoubas, Nicolas Hotellier, Olivier Thomas:
Thermo-mechanical study of a 2.5D passive silicon interposer technology: Experimental, numerical and In-Situ stress sensors developments. 3DIC 2013: 1-7 - 2010
- [j1]Sébastien Gallois-Garreignot, Vincent Fiori, D. Nelias:
Fracture phenomena induced by Front-End/Back-End interactions: Dedicated failure analysis and numerical developments. Microelectron. Reliab. 50(1): 75-85 (2010)
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