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ORCIDSheldon X.-D. Tan
- > Home > Persons > Sheldon X.-D. Tan
Publications
- 2017
[j71]Xin Huang, Valeriy Sukharev
, Taeyoung Kim, Sheldon X.-D. Tan:
Dynamic electromigration modeling for transient stress evolution and recovery under time-dependent current and temperature stressing. Integr. 58: 518-527 (2017)- 2016
- [j68]Kai He, Xin Huang, Sheldon X.-D. Tan:
EM-Based On-Chip Aging Sensor for Detection of Recycled ICs. IEEE Des. Test 33(5): 56-64 (2016) - [j66]Xin Huang, Valeriy Sukharev, Jun-Ho Choy, Marko Chew, Taeyoung Kim, Sheldon X.-D. Tan:
Electromigration assessment for power grid networks considering temperature and thermal stress effects. Integr. 55: 307-315 (2016) - [j64]Hai-Bao Chen, Sheldon X.-D. Tan, Xin Huang, Taeyoung Kim, Valeriy Sukharev:
Analytical Modeling and Characterization of Electromigration Effects for Multibranch Interconnect Trees. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 35(11): 1811-1824 (2016) - [j63]Xin Huang, Armen Kteyan, Sheldon X.-D. Tan, Valeriy Sukharev:
Physics-Based Electromigration Models and Full-Chip Assessment for Power Grid Networks. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 35(11): 1848-1861 (2016) - [c131]Xin Huang, Valeriy Sukharev, Taeyoung Kim, Hai-Bao Chen, Sheldon X.-D. Tan:
Electromigration recovery modeling and analysis under time-dependent current and temperature stressing. ASP-DAC 2016: 244-249 - [c128]Xin Huang, Valeriy Sukharev, Zhongdong Qi, Taeyoung Kim, Sheldon X.-D. Tan:
Physics-based full-chip TDDB assessment for BEOL interconnects. DAC 2016: 45:1-45:6 - [c127]Taeyoung Kim, Xin Huang, Hai-Bao Chen, Valeriy Sukharev, Sheldon X.-D. Tan:
Learning-based dynamic reliability management for dark silicon processor considering EM effects. DATE 2016: 463-468 - [c125]Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Taeyoung Kim, Xin Huang, Sheldon X.-D. Tan:
Voltage-based electromigration immortality check for general multi-branch interconnects. ICCAD 2016: 113 - 2015
- [j58]Hai-Bao Chen, Sheldon X.-D. Tan, David H. Shin, Xin Huang, Hai Wang, Guoyong Shi:
H2-matrix-based finite element linear solver for fast transient thermal analysis of high-performance ICs. Int. J. Circuit Theory Appl. 43(12): 1953-1970 (2015) - [j57]Hai-Bao Chen, Ying-Chi Li, Sheldon X.-D. Tan, Xin Huang, Hai Wang, Ngai Wong:
H-Matrix-Based Finite-Element-Based Thermal Analysis for 3D ICs. ACM Trans. Design Autom. Electr. Syst. 20(4): 47:1-47:25 (2015) - [j56]Zao Liu, Sheldon X.-D. Tan, Xin Huang, Hai Wang:
Task Migrations for Distributed Thermal Management Considering Transient Effects. IEEE Trans. Very Large Scale Integr. Syst. 23(2): 397-401 (2015) - [c118]Hai-Bao Chen, Sheldon X.-D. Tan, Xin Huang, Valeriy Sukharev:
New electromigration modeling and analysis considering time-varying temperature and current densities. ASP-DAC 2015: 352-357 - [c116]Hai-Bao Chen, Sheldon X.-D. Tan, Valeriy Sukharev, Xin Huang, Taeyoung Kim:
Interconnect reliability modeling and analysis for multi-branch interconnect trees. DAC 2015: 90:1-90:6 - [c115]Kai He, Xin Huang, Sheldon X.-D. Tan:
EM-Based on-Chip Aging Sensor for Detection and Prevention of Counterfeit and Recycled ICs. ICCAD 2015: 146-151 - 2014
- [c108]Xin Huang, Tan Yu, Valeriy Sukharev, Sheldon X.-D. Tan:
Physics-based Electromigration Assessment for Power Grid Networks. DAC 2014: 80:1-80:6 - [c106]Valeriy Sukharev, Xin Huang, Hai-Bao Chen, Sheldon X.-D. Tan:
IR-drop based electromigration assessment: parametric failure chip-scale analysis. ICCAD 2014: 428-433 - [c104]Ying-Chi Li, Sheldon X.-D. Tan, Tan Yu, Xin Huang, Ngai Wong:
Direct finite-element-based solver for 3D-IC thermal analysis via H-matrix representation. ISQED 2014: 386-391 - 2013
- [c102]Zao Liu, Xin Huang, Sheldon X.-D. Tan, Hai Wang, He Tang:
Distributed task migration for thermal hot spot reduction in many-core microprocessors. ASICON 2013: 1-4
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