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Publication search results
found 198 matches
- 2024
- Simon Friedrich, Robert Wittig, Emil Matús, Darius Grantz, Martin Zeller, Jens Benndorf, Gerhard P. Fettweis:
A 22 nm 10 TOPS Mixed-Precision Neural Network SoC for Image Processing with Energy-Efficient Dilated Convolution Support. COOL CHIPS 2024: 1-3 - Jueun Jung, Seungbin Kim, Bokyoung Seo, Wuyoung Jang, Sangho Lee, Jeongmin Shin, Donghyeon Han, Kyuho Jason Lee:
A Low-power and Real-time Semantic LiDAR SLAM Processor with Point Neural Network Segmentation and kNN Acceleration for Mobile Robots. COOL CHIPS 2024: 1-3 - Dohyun Kim, Koki Asahina, Yirong Kan, Renyuan Zhang, Yasuhiko Nakashima:
Power-Efficient Acceleration of GCNs on Coarse-Grained Linear Arrays. COOL CHIPS 2024: 1-5 - Sangjin Kim, Zhiyong Li, Soyeon Um, Wooyoung Jo, Sangwoo Ha, Sangyeob Kim, Hoi-Jun Yoo:
NoPIM: Functional Network-on-Chip Architecture for Scalable High-Density Processing-in-Memory-based Accelerator. COOL CHIPS 2024: 1-3 - Takuya Kojima, Yosuke Yanai, Hayate Okuhara, Hideharu Amano, Morihiro Kuga, Masahiro Iida:
SLMLET: A RISC-V Processor SoC with Tightly-Coupled Area-Efficient eFPGA Blocks. COOL CHIPS 2024: 1-6 - Qi Li, Masato Edahiro:
Template-Based Automatic Library Function Generation with Halide for Compute-Intensive Simulink Models. COOL CHIPS 2024: 1-6 - Zirui Lin, Katsutoshi Itoyama, Kazuhiro Nakadai, Hideharu Amano:
FPGA-based Low Power Acceleration of HARK Sound Source Localization. COOL CHIPS 2024: 1-6 - Pham Hoai Luan, Hai Hau Nguyen, Vu Trung Duong Le, Thi Diem Tran, Tuan Hai Vu, Thi Hong Tran, Yasuhiko Nakashima:
MRCA: Multi-grained Reconfigurable Cryptographic Accelerator for Diverse Security Requirements. COOL CHIPS 2024: 1-6 - Reoma Matsuo, Yuya Degawa, Hidetsugu Irie, Shuichi Sakai, Ryota Shioya:
Branch Divergence-Aware Flexible Approximating Technique on GPUs. COOL CHIPS 2024: 1-6 - Muhammad Sulthan Mazaya, Eko Mursito Budi, Infall Syafalni, Nana Sutisna, Trio Adiono:
Reinforcement Learning Hardware Accelerator using Cache-Based Memoization for Optimized Q-Table Selection. COOL CHIPS 2024: 1-6 - Kento Mishima, Naoya Niwa, Kazutoshi Wakabayashi, Hiroe Iwasaki:
ISP Parameter Optimization and FPGA Implementation for Object Detection in Low-Light Conditions. COOL CHIPS 2024: 1-3 - Seunghyun Park, Daejin Park:
Bit-Separable Radix-4 Booth Multiplier for Power-Efficient CNN Accelerator. COOL CHIPS 2024: 1-6 - Gwangtae Park, Seokchan Song, Haoyang Sang, Dongseok Im, Donghyeon Han, Sangyeob Kim, Hongseok Lee, Hoi-Jun Yoo:
A Low-power and Real-time Neural-Rendering Dense SLAM Processor with 3-Level Hierarchical Sparsity Exploitation. COOL CHIPS 2024: 1-3 - Junha Ryu, Hankyul Kwon, Wonhoon Park, Zhiyong Li, Beomseok Kwon, Donghyeon Han, Dongseok Im, Sangyeob Kim, Hyungnam Joo, Minsung Kim, Hoi-Jun Yoo:
A Low-Power Neural Graphics System for Instant 3D Modeling and Real-Time Rendering on Mobile AR/VR Devices. COOL CHIPS 2024: 1-3 - Daiki Saito, Siyi Hu, Yukinori Sato:
A Microservice Scheduler for Heterogeneous Resources on Edge-Cloud Computing Continuum. COOL CHIPS 2024: 1-6 - IEEE Symposium in Low-Power and High-Speed Chips, COOL CHIPS 2024, Tokyo, Japan, April 17-19, 2024. IEEE 2024, ISBN 979-8-3503-8414-7 [contents]
- 2023
- Donghyeon Han, Junha Ryu, Sangyeob Kim, Sangjin Kim, Jongjun Park, Hoi-Jun Yoo:
A Low-power Neural 3D Rendering Processor with Bio-inspired Visual Perception Core and Hybrid DNN Acceleration. COOL CHIPS 2023: 1-3 - Genta Inoue, Daiki Okonogi, Thiem Van Chu, Jaehoon Yu, Masato Motomura, Kazushi Kawamura:
Flexibly Controllable Dynamic Cooling Methods for Solid-State Annealing Processors to Improve Combinatorial Optimization Performance. COOL CHIPS 2023: 1-3 - Tobias Kaiser, Friedel Gerfers:
A 2.41-μW/MHz, 437-PE/mm2 CGRA in 22 nm FD-SOI With RISC-Like Code Generation. COOL CHIPS 2023: 1-6 - Sangyeob Kim, Soyeon Kim, Seongyon Hong, Sangjin Kim, Donghyeon Han, Jiwon Choi, Hoi-Jun Yoo:
COOL-NPU: Complementary Online Learning Neural Processing Unit with CNN-SNN Heterogeneous Core and Event-driven Backpropagation. COOL CHIPS 2023: 1-3 - Tatsuya Kubo, Shinya Takamaeda-Yamazaki:
Cachet: A High-Performance Joint-Subtree Integrity Verification for Secure Non-Volatile Memory. COOL CHIPS 2023: 1-6 - Takeshi Ohkawa, Masahiro Aoyagi:
FPGA Emulation of Through-Silicon-Via (TSV) Dataflow Network for 3D Standard Chip Stacking System. COOL CHIPS 2023: 1-3 - Anawin Opasatian, Makoto Ikeda:
Lookup Table Modular Reduction: A Low-Latency Modular Reduction for Fast ECC Processor. COOL CHIPS 2023: 1-6 - Ziquan Qin, Kaijie Wei, Hideharu Amano, Kazuhiro Nakadai:
Low power implementation of Geometric High-order Decorrelation-based Source Separation on an FPGA board. COOL CHIPS 2023: 1-6 - Viktor Razilov, Juncen Zhong, Emil Matús, Gerhard P. Fettweis:
Dual Vector Load for Improved Pipelining in Vector Processors. COOL CHIPS 2023: 1-6 - Infall Syafalni, Mohamad Imam Firdaus, Andi M. Riyadhus Ilmy, Nana Sutisna, Trio Adiono:
MazeCov-Q: An Efficient Maze-Based Reinforcement Learning Accelerator for Coverage. COOL CHIPS 2023: 1-6 - Jinsung Yoon, Donghyun Lee, Neungyun Kim, Su-Jung Lee, Gil-Ho Kwak, Tae-Hwan Kim:
A Real-Time Keyword Spotting System Based on an End-To-End Binary Convolutional Neural Network in FPGA. COOL CHIPS 2023: 1-3 - IEEE Symposium in Low-Power and High-Speed Chips, COOL CHIPS 2023, Tokyo, Japan, April 19-21, 2023. IEEE 2023, ISBN 979-8-3503-3201-8 [contents]
- 2022
- Yuki Abe, Kazutoshi Kobayashi, Jun Shiomi, Hiroyuki Ochi:
Zero-standby-power Nonvolatile Standard Cell Memory Using FiCC for IoT Processors with Intermittent Operations. COOL CHIPS 2022: 1-6 - Yang Chen, Lin Liu, Xuelin Feng, Jinglin Shi:
DXT501: An SDR-Based Baseband MP-SoC for Multi-Protocol Industrial Wireless Communication. COOL CHIPS 2022: 1-6
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