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Léa Di Cioccio
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2020 – today
- 2022
- [c11]Josua Guérid, Jean-Baptiste Doré, Jacques Reverdy, Bruno Reig, Antonio Clemente, Léa Di Cioccio:
Toward Eco-Design of a 5G mmWave Transmitarray Antenna Based on Life Cycle Assessment. EuCNC 2022: 440-445
2010 – 2019
- 2014
- [c10]Yann Beilliard
, Stéphane Moreau
, Léa Di Cioccio, Perceval Coudrain
, G. Romano, A. Nowodzinski, F. Aussenac, P.-H. Jouneau, E. Rolland, Thomas Signamarcheix:
Advances toward reliable high density Cu-Cu interconnects by Cu-SiO2 direct hybrid bonding. 3DIC 2014: 1-8 - 2013
- [c9]Yann Beilliard
, Perceval Coudrain
, Léa Di Cioccio, Stéphane Moreau
, Loic Sanchez, Brigitte Montmayeul, Thomas Signamarcheix, Rafael Estevez, Guillaume Parry
:
Chip to wafer copper direct bonding electrical characterization and thermal cycling. 3DIC 2013: 1-7 - [c8]Ionut Radu
, Gweltaz Gaudin, William van den Daele, Fabrice Letertre, Carlos Mazure, Léa Di Cioccio, Thomas Lacave, Frederic Mazen, Pascal Scheiblin, Thomas Signamarcheix, Sorin Cristoloveanu:
Novel low temperature 3D wafer stacking technology for high density device integration. ESSDERC 2013: 151-154 - [c7]Mariam Sadaka, Ionut Radu
, Chrystelle Lagahe-Blanchard, Léa Di Cioccio:
Smart Stacking™ and Smart Cut™ technologies for wafer level 3D integration. ICICDT 2013: 231-234 - 2012
- [j3]H. Moriceau, F. Rieutord, F. Fournel, Léa Di Cioccio, C. Moulet, Luc Libralesso, Pierric Gueguen, Rachid Taibi, C. Deguet:
Low temperature direct bonding: An attractive technique for heterostructures build-up. Microelectron. Reliab. 52(2): 331-341 (2012) - 2011
- [c6]Léa Di Cioccio, Rachid Taibi, Cédrick Chappaz, Stéphane Moreau
, Laurent-Luc Chapelon, Thomas Signamarcheix:
200°C direct bonding copper interconnects : Electrical results and reliability. 3DIC 2011: 1-4 - [c5]Sebastien Mermoz, Loic Sanchez, Léa Di Cioccio, Jean Berthier, Emilie Deloffre, Christian Fretigny:
Impact of containment and deposition method on sub-micron chip-to-wafer self-assembly yield. 3DIC 2011: 1-5 - 2010
- [c4]Ionut Radu
, Didier Landru, Gweltaz Gaudin, Gregory Riou, Catherine Tempesta, Fabrice Letertre, Léa Di Cioccio, Pierric Gueguen, Thomas Signamarcheix, C. Euvrard, Jérôme Dechamp, Laurent Clavelier, Mariam Sadaka:
Recent Developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking. 3DIC 2010: 1-6
2000 – 2009
- 2009
- [j2]Gilles Poupon, Nicolas Sillon, David Henry, Charlotte Gillot, Alan Mathewson
, Léa Di Cioccio, Barbara Charlet, Patrick Leduc, Maud Vinet, Perrine Batude:
System on Wafer: A New Silicon Concept in SiP. Proc. IEEE 97(1): 60-69 (2009) - [c3]Léa Di Cioccio, Pierric Gueguen, Rachid Taibi, Thomas Signamarcheix, Laurent Bally, Laurent Vandroux, Marc Zussy, Sophie Verrun, Jérôme Dechamp, Patrick Leduc, Myriam Assous, David Bouchu, François de Crecy, Laurent-Luc Chapelon, Laurent Clavelier:
An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling. 3DIC 2009: 1-4 - [c2]Patrick Leduc, Myriam Assous, Léa Di Cioccio, Marc Zussy, Thomas Signamarcheix, Antonio Roman, Maxime Rousseau, Sophie Verrun, Laurent Bally, David Bouchu, Lionel Cadix, Alexis Farcy, Nicolas Sillon:
First integration of Cu TSV using die-to-wafer direct bonding and planarization. 3DIC 2009: 1-5 - 2007
- [j1]Alberto Fazzi, Luca Magagni, Mauro Mirandola, Barbara Charlet, Léa Di Cioccio, Erik Jung
, Roberto Canegallo, Roberto Guerrieri:
3-D Capacitive Interconnections for Wafer-Level and Die-Level Assembly. IEEE J. Solid State Circuits 42(10): 2270-2282 (2007) - [c1]Roberto Canegallo, Alberto Fazzi, Luca Ciccarelli, Luca Magagni, Federico Natali, Pier Luigi Rolandi, Erik Jung
, Léa Di Cioccio, Roberto Guerrieri:
3D Capacitive Interconnections for High Speed Interchip Communication. CICC 2007: 1-8
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