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Tadatomo Suga
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2020 – today
- 2023
- [j12]Hangning Shi, Ailun Yi, Jiaxin Ding, Xudong Liu, Qingcheng Qin, Juemin Yi, Junjie Hu, Miao Wang, Demin Cai, Jianfeng Wang, Ke Xu, Fengwen Mu, Tadatomo Suga, René Heller, Mao Wang, Shengqiang Zhou, Wenhui Xu, Kai Huang, Tiangui You, Xin Ou:
Defect evolution in GaN thin film heterogeneously integrated with CMOS-compatible Si(100) substrate by ion-cutting technology. Sci. China Inf. Sci. 66(11) (2023)
2010 – 2019
- 2019
- [j11]Michitaka Yamamoto
, Takashi Matsumae
, Yuichi Kurashima, Hideki Takagi
, Tadatomo Suga
, Toshihiro Itoh, Eiji Higurashi
:
Growth Behavior of Au Films on SiO2 Film and Direct Transfer for Smoothing Au Surfaces. Int. J. Autom. Technol. 13(2): 254-260 (2019) - 2017
- [j10]Eiji Higurashi
, Ken Okumura, Yutaka Kunimune, Tadatomo Suga
, Kei Hagiwara:
Room-Temperature Bonding of Wafers with Smooth Au Thin Films in Ambient Air Using a Surface-Activated Bonding Method. IEICE Trans. Electron. 100-C(2): 156-160 (2017) - 2016
- [j9]Eiji Higurashi
, Michitaka Yamamoto
, Takeshi Sato, Tadatomo Suga
, Renshi Sawada:
Room-Temperature Gold-Gold Bonding Method Based on Argon and Hydrogen Gas Mixture Atmospheric-Pressure Plasma Treatment for Optoelectronic Device Integration. IEICE Trans. Electron. 99-C(3): 339-345 (2016) - 2015
- [j8]Masahisa Fujino
, Ikuo Soga, Daiyu Kondo, Yoshikatsu Ishizuki, Taisuke Iwai, Tadatomo Suga
:
Fast atom bombardment onto vertically aligned multi-walled carbon nanotube bumps to achieve low interconnect resistance with Au layer. Microelectron. Reliab. 55(12): 2560-2564 (2015) - 2012
- [j7]Tadatomo Suga
, Jenn-Ming Song
, Yi-Shao Lai:
Guest Editorial - Low Temperature Processing for Microelectronics and Microsystems Packaging. Microelectron. Reliab. 52(2): 301 (2012) - [j6]Ryuichi Kondou, Chenxi Wang
, Akitsu Shigetou, Tadatomo Suga
:
Nanoadhesion layer for enhanced Si-Si and Si-SiN wafer bonding. Microelectron. Reliab. 52(2): 342-346 (2012) - [j5]Chenxi Wang
, Tadatomo Suga
:
Investigation of fluorine containing plasma activation for room-temperature bonding of Si-based materials. Microelectron. Reliab. 52(2): 347-351 (2012) - 2011
- [c3]Tadatomo Suga
, Ryuichi Kondoh:
Low temperature bonding for 3D interconnects. 3DIC 2011: 1-4
2000 – 2009
- 2009
- [j4]Eiji Higurashi
, Renshi Sawada, Tadatomo Suga
:
Optical Microsensors Integration Technologies for Biomedical Applications. IEICE Trans. Electron. 92-C(2): 231-238 (2009) - [j3]Eiji Higurashi
, Daisuke Chino, Tadatomo Suga
:
Residue-Free Solder Bumping Using Small AuSn Particles by Hydrogen Radicals. IEICE Trans. Electron. 92-C(2): 247-251 (2009) - 2007
- [j2]Ryo Takigawa, Eiji Higurashi
, Tadatomo Suga
, Satoshi Shinada, Tetsuya Kawanishi:
Low-Temperature Au-to-Au Bonding for LiNbO3/Si Structure Achieved in Ambient Air. IEICE Trans. Electron. 90-C(1): 145-146 (2007) - 2003
- [j1]Qian Wang, Naoe Hosoda
, Toshihiro Itoh, Tadatomo Suga
:
Reliability of Au bump-Cu direct interconnections fabricated by means of surface activated bonding method. Microelectron. Reliab. 43(5): 751-756 (2003) - [c2]Kenichi Kataoka, Toshihiro Itoh, Tadatomo Suga:
Low Contact-Force Fritting Probe Card Using Buckling Microcantilevers. ITC 2003: 1008-1013 - 2002
- [c1]Kenichi Kataoka, Toshihiro Itoh, Katsuya Okumura, Tadatomo Suga:
Low-Contact-Force Probing on Copper Electrodes. ITC 2002: 424-429
Coauthor Index
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