"Residue-Free Solder Bumping Using Small AuSn Particles by Hydrogen Radicals."

Eiji Higurashi, Daisuke Chino, Tadatomo Suga (2009)

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DOI: 10.1587/TRANSELE.E92.C.247

access: closed

type: Journal Article

metadata version: 2020-04-11

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Eiji Higurashi, Daisuke Chino, Tadatomo Suga:
Residue-Free Solder Bumping Using Small AuSn Particles by Hydrogen Radicals. IEICE Trans. Electron. 92-C(2): 247-251 (2009)

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