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ORCIDTai Chong Chai
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2010 – 2019
- 2012
[j8]A. D. Trigg, Tai Chong Chai, Xiaowu Zhang
, Xian Tong Chen, Leong Ching Wai:
Modular sensor chip design for package stress evaluation and reliability characterisation. Microelectron. Reliab. 52(8): 1581-1585 (2012)- 2010
- [j7]Yung Chuen Tan, Cher Ming Tan, Xiaowu Zhang, Tai Chong Chai, D. Q. Yu:
Electromigration performance of Through Silicon Via (TSV) - A modeling approach. Microelectron. Reliab. 50(9-11): 1336-1340 (2010)
2000 – 2009
- 2008
- [j6]Xiaowu Zhang, Kripesh Vaidyanathan, Tai Chong Chai, Teck Chun Tan, D. Pinjala:
Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP). Microelectron. Reliab. 48(4): 602-610 (2008) - 2007
- [j5]Cher Ming Tan, Stanny Yanuar, Tai Chong Chai:
Finite element modeling of capacitive coupling voltage contrast. Microelectron. Reliab. 47(9-11): 1555-1560 (2007) - 2006
- [j4]Cher Ming Tan, Zhenghao Gan, Tai Chong Chai:
Feasibility study of the application of voltage contrast to printed circuit board. Microelectron. Reliab. 46(5-6): 939-948 (2006) - 2005
- [j3]Cher Ming Tan, Kim Peng Lim, Tai Chong Chai, Guat Cheng Lim:
Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist. Microelectron. Reliab. 45(9-11): 1572-1575 (2005) - 2004
- [j2]Xiaowu Zhang, Ee-Hua Wong, Charles Lee, Tai Chong Chai, Yiyi Ma, Poi-Siong Teo, D. Pinjala, Srinivasamurthy Sampath:
Thermo-mechanical finite element analysis in a multichip build up substrate based package design. Microelectron. Reliab. 44(4): 611-619 (2004) - 2002
- [j1]Mohandass Sivakumar, Kripesh Vaidyanathan, Chong Ser Choong, Tai Chong Chai, Loon Aik Lim:
Reliability of Wire Bonding on Low-k Dielectric Material in Damascene Copper Integrated Circuits PBGA Assembly. Microelectron. Reliab. 42(9-11): 1535-1540 (2002)
Coauthor Index
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