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"Electromigration performance of Through Silicon Via (TSV) - A modeling ..."

Yung Chuen Tan et al. (2010)

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DOI: 10.1016/J.MICROREL.2010.07.024

access: closed

type: Journal Article

metadata version: 2022-10-04

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Yung Chuen Tan, Cher Ming Tan, Xiaowu Zhang, Tai Chong Chai, D. Q. Yu:
Electromigration performance of Through Silicon Via (TSV) - A modeling approach. Microelectron. Reliab. 50(9-11): 1336-1340 (2010)

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