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ORCIDDidier Lattard
- > Home > Persons > Didier Lattard
Publications
- 2021
[j7]Pascal Vivet
, Eric Guthmuller, Yvain Thonnart, Gaël Pillonnet, César Fuguet Tortolero, Ivan Miro-Panades, Guillaume Moritz, Jean Durupt, Christian Bernard, Didier Varreau, Julian J. H. Pontes, Sébastien Thuries, David Coriat, Michel Harrand, Denis Dutoit, Didier Lattard, Lucile Arnaud, Jean Charbonnier, Perceval Coudrain, Arnaud Garnier, Frédéric Berger, Alain Gueugnot, Alain Greiner, Quentin L. Meunier, Alexis Farcy, Alexandre Arriordaz, Séverine Cheramy, Fabien Clermidy:
IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management. IEEE J. Solid State Circuits 56(1): 79-97 (2021)- 2020
- [c36]Pascal Vivet, Eric Guthmuller, Yvain Thonnart, Gaël Pillonnet, Guillaume Moritz, Ivan Miro-Panades, César Fuguet Tortolero, Jean Durupt, Christian Bernard, Didier Varreau, Julian J. H. Pontes, Sébastien Thuries, David Coriat, Michel Harrand, Denis Dutoit, Didier Lattard, Lucile Arnaud, Jean Charbonnier, Perceval Coudrain, Arnaud Garnier, Frédéric Berger, Alain Gueugnot, Alain Greiner, Quentin L. Meunier, Alexis Farcy, Alexandre Arriordaz, Séverine Cheramy, Fabien Clermidy:
2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm2 Inter-Chiplet Interconnects and 156mW/mm2@ 82%-Peak-Efficiency DC-DC Converters. ISSCC 2020: 46-48 - 2017
- [j6]Pascal Vivet, Yvain Thonnart, Romain Lemaire, Cristiano Santos, Edith Beigné, Christian Bernard, Florian Darve, Didier Lattard, Ivan Miro Panades, Denis Dutoit, Fabien Clermidy, Séverine Cheramy, Abbas Sheibanyrad, Frédéric Pétrot, Eric Flamand, Jean Michailos, Alexandre Arriordaz, Lee Wang, Juergen Schloeffel:
A 4 × 4 × 2 Homogeneous Scalable 3D Network-on-Chip Circuit With 326 MFlit/s 0.66 pJ/b Robust and Fault Tolerant Asynchronous 3D Links. IEEE J. Solid State Circuits 52(1): 33-49 (2017) - 2016
- [j5]Perceval Coudrain, Papa Momar Souare, Rafael Prieto, Vincent Fiori, Alexis Farcy, Laurent Le Pailleur, Jean-Philippe Colonna, Cristiano Santos, Pascal Vivet, M. Haykel Ben Jamaa, Denis Dutoit, François de Crecy, Sylvain Dumas, Christian Chancel, Didier Lattard, Séverine Cheramy:
Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits. IEEE Des. Test 33(3): 21-36 (2016) - 2015
- [c23]Pascal Vivet, Christian Bernard, Fabien Clermidy, Denis Dutoit, Eric Guthmuller, Ivan Miro Panades, Gaël Pillonnet, Yvain Thonnart, Arnaud Garnier, Didier Lattard, Amandine Jouve, Franck Bana, Thierry Mourier, Séverine Cheramy:
3D advanced integration technology for heterogeneous systems. 3DIC 2015: FS6.1-FS6.3
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