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Ja-Myeong Koo

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Journal Articles

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2008
[j2]
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  dblp key:
  - journals/mr/YoonCNKKLJ08
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  - https://dblp.org/rec/journals/mr/YoonCNKKLJ08
Jeong-Won Yoon, Hyun-Suk Chun, Bo-In Noh, Ja-Myeong Koo, Jong-Woong Kim, Hoo-Jeong Lee, Seung-Boo Jung:
Mechanical reliability of Sn-rich Au-Sn/Ni flip chip solder joints fabricated by sequential electroplating method. Microelectron. Reliab. 48(11-12): 1857-1863 (2008)
2007
[j1]
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Ja-Myeong Koo, Seung-Boo Jung:
Effect of displacement rate on ball shear properties for Sn-37Pb and Sn-3.5Ag BGA solder joints during isothermal aging. Microelectron. Reliab. 47(12): 2169-2178 (2007)

Informal and Other Publications

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2007
[i2]
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  - journals/corr/abs-0711-3306
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Ja-Myeong Koo, Seung-Boo Jung:
Effect of Surface Finish of Substrate on Mechanical Reliability of in-48SN Solder Joints in Moems Package. CoRR abs/0711.3306 (2007)
[i1]
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  dblp key:
  - journals/corr/abs-0711-3323
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Jeong-Won Yoon, Hyun-Suk Chun, Ja-Myeong Koo, Seung-Boo Jung:
Au-SN Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications. CoRR abs/0711.3323 (2007)

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