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"Mechanical reliability of Sn-rich Au-Sn/Ni flip chip solder joints ..."

Jeong-Won Yoon et al. (2008)

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DOI: 10.1016/J.MICROREL.2008.09.008

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/YoonCNKKLJ08
Jeong-Won Yoon, Hyun-Suk Chun, Bo-In Noh, Ja-Myeong Koo, Jong-Woong Kim, Hoo-Jeong Lee, Seung-Boo Jung:
Mechanical reliability of Sn-rich Au-Sn/Ni flip chip solder joints fabricated by sequential electroplating method. Microelectron. Reliab. 48(11-12): 1857-1863 (2008)

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